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Study on the ultrasonic guided wave and online visual monitoring for ultrasonic precise bonding

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Abstract

Ultrasonic precise bonding is an emerging technology in the application of polymer micro-assembly. The propagation of ultrasound changes with the interfacial polymer physical state in the ultrasonic bonding process. So the ultrasonic guided wave is an effective parameter to in-situ monitor the fusion degree. The time-frequency characteristics in the ultrasonic guided wave are analyzed by vibration analysis methods. The polymer interfacial fusion is online visual monitored by the high-speed HD camera. The fusion behavior of the thermal melt interface and the time-frequency characteristics are analyzed and correlated. Results indicate that the change of the interfacial thermal melt state is related to the time-frequency characteristics of the ultrasonic guided wave. The generation of the melting zone, the fusion of the melting zone, the rotation of the micro-device, the generation or disappearance of local air bubbles all lead to the changing of the harmonic frequency and intensity in the ultrasonic bonding process.

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The authors declare that the data and the materials of this study are available within the article.

References

  1. West J, Becker M, Tombrink S, Manz A (2008) Micro total analysis systems: latest achievements. Anal Chem 80:4403–4419. https://doi.org/10.1021/ac800680j

    Article  Google Scholar 

  2. Liu C (2007) Recent developments in polymer MEMS. Adv Mater 19:3783–3790. https://doi.org/10.1002/adma.200701709

    Article  Google Scholar 

  3. Li J, Chen D, Chen G (2005) Low-temperature thermal bonding of PMMA microfluidic chips. Anal Lett 38:1127–1136. https://doi.org/10.1081/AL-200057209

    Article  Google Scholar 

  4. Ussing T, Petersen LV, Nielsen CB, Helbo B, Højslet L (2007) Micro laser welding of polymer microstructures using low power laser diodes. Int J Adv Manuf Technol 33:198–205. https://doi.org/10.1007/s00170-007-0969-0

    Article  Google Scholar 

  5. Huang FC, Chen YF, Lee GB (2007) CE chips fabricated by injection molding and polyethylene/thermoplastic elastomer film packaging methods. Electrophoresis 28:1130–1137. https://doi.org/10.1002/elps.200600351

    Article  Google Scholar 

  6. Sari F, Hoffmann WM, Haberstroh E, Poprawe R (2008) Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts. Microsyst Technol 14:1879–1886. https://doi.org/10.1007/s00542-008-0675-3

    Article  Google Scholar 

  7. Sackmann J, Burlage K, Gerhardy C, Memering B, Liao S, Schomburg WK (2015) Review on ultrasonic fabrication of polymer micro devices. Ultrasonics 56:189–200. https://doi.org/10.1016/j.ultras.2014.08.007

    Article  Google Scholar 

  8. Wu WQ, Peng HJ, Jia YL, Jiang BY (2017) Characteristics and mechanisms of polymer interfacial friction heating in ultrasonic plasticization for micro injection molding. Microsyst Technol 23:1385–1392. https://doi.org/10.1007/s00542-016-2877-4

    Article  Google Scholar 

  9. Zhang ZB, Wang XD, Luo Y, Zhang ZQ, Wang LD (2010) Study on heating process of ultrasonic welding for thermoplastics. J Thermoplast Compos Mater 23:647–664. https://doi.org/10.1177/0892705709356493

    Article  Google Scholar 

  10. Matheny MP, Graff KF (2015) Ultrasonic welding of metals. In: Gallego-Juárez JA, Graffpp KF (eds) Power Ultrasonics, 1st edn. Woodhead Publishing, England, pp 259–293

    Chapter  Google Scholar 

  11. Benatar A (2015) Ultrasonic welding of plastics and polymeric composites. In: Gallego-Juárez JA, Graffpp KF (eds) Power Ultrasonics, 1st edn. Woodhead Publishing, England, pp 295–312

    Chapter  Google Scholar 

  12. Truckenmueller R, Chen Y, Ahrens R et al (2006) Micro ultrasonic welding: joining of chemically inert polymer microparts for single material fluidic components and systems. Microsyst Technol 12:1027–1029. https://doi.org/10.1007/s00542-006-0136-9

    Article  Google Scholar 

  13. Li JM, Meng FJ, Liang C, Liu C (2017) Energy director structure and self-balancing jig for the ultrasonic bonding of microfluidic chips. Micro Nano Lett 12:453–457. https://doi.org/10.1049/mnl.2017.0028

    Article  Google Scholar 

  14. Kim JB, Jeong BW, Chiao M, Lin LW (2009) Ultrasonic bonding for MEMS sealing and packaging. IEEE Trans Adv Packag 32:461–467. https://doi.org/10.1109/TADVP.2008.2009927

  15. Zhang ZB, He QQ, Yan CQ (2014) Non-melt ultrasonic bonding method for polymer MEMS devices. AMM 607:133–138. https://doi.org/10.4028/www.scientific.net/AMM.607.133

    Article  Google Scholar 

  16. Sun YB, Teng TD, Guo GQ, Wu GX (2019) An ultrasonic bonding method controlled by the characteristic waveform of ultrasonic propagation. Micro Nano Lett 14:547–550. https://doi.org/10.1049/MNL.2018.5461

    Article  Google Scholar 

Download references

Funding

This work was supported by Liaoning Province “Xingliao Talent Program” project for young top talents (XLYC1807112)

General program funding for the China Postdoctoral Science Foundation (2019M651103).

The National Science Foundation of China under Grant (52005071).

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Authors and Affiliations

  1. College of Locomotive and Rolling stock Engineering, Dalian Jiaotong University, Dalian, China

    Yibo Sun & Mengruo Cao

  2. Dalian Key Laboratory of Welded Structures and Intelligent Manufacturing Technology of Rail Transportation Equipment, Dalian, China

    Li Zou & Xinhua Yang

Authors
  1. Yibo Sun
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  2. Mengruo Cao
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  3. Li Zou
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  4. Xinhua Yang
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Contributions

Sun YB was responsible for the formulation of the overall plan. Cao MR was responsible for the experimental part. Zou L was responsible for the data analysis. Yang XH was responsible for the development of the detection system.

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Correspondence to Yibo Sun.

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Sun, Y., Cao, M., Zou, L. et al. Study on the ultrasonic guided wave and online visual monitoring for ultrasonic precise bonding. Int J Adv Manuf Technol 117, 971–984 (2021). https://doi.org/10.1007/s00170-021-07799-5

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  • DOI: https://doi.org/10.1007/s00170-021-07799-5

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