The results of an investigation of the process of cutting mica using ultrashort pulsed pico- and femtosecond laser radiation with wavelength 1030 nm are reported. The pulses were focused by a lens with a small numerical aperture (numerical aperture < 0.1). Optimization of the conditions for achieving large-scale processing without micron-size microcracks along the edges and walls is performed at different pulse durations, pulse energies, and scanning speeds. Samples with thickness 0.1 – 0.2 mm were cut out, and the desired result was achieved without visible heat-affected zones. It was determined that when mica processing is needed in mass production it is essential to use a system for real-time tracking of the sample surface in order to adjust the position of the focus on the entire sheet.
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References
V. S. Kondratenko and O. N. Tret’yakova, Problems of the Development of New Laser Technologies [in Russian], Izd. MAI, Moscow (2018).
V. S. Kondratenko, V. V. Kadomkin, Lu Hung-Tu, et al., “Technology of laser immersion processing of materials,” Pribory, No. 4, 1 – 8 (2020).
P. Boerner, M. Hajri, T. Wahl, et al., “Picosecond pulsed laser ablation of dielectric rods: Angle-dependent ablation process model for laser micromachining,” J. Appl. Phys., 125, 234902 (2019).
E. N. Glezer and E. Mazur, “Optically produced cross patterning, based on local dislocations inside MgO single crystals,” Appl. Phys. Lett., 71, 882 (1997).
M. Lenzner, J. Krüger, S. Sartania, et al., “Femtosecond optical breakdown in dielectrics,” Phys. Rev. Lett., 80, 4076 (1998).
Yunxiang Pan, Xueming Lv, Hongchao Zhang, et al., “Millisecond laser machining of transparent materials assisted by a nanosecond laser with different delays,” Opt. Lett., 41(12), 2807 – 2810 (2016).
H. Varel, D. Ashkenasi, A. Rosenfeld, et al., “Micromachining of quartz with ultrashort pulses,” Appl. Phys. A, 65(4), 367 – 373 (1997).
T. Q. Jia, Z. Z. Xu, R. X. Li, and H. Z. Wang, “Mechanisms in fsec-laser ablation in fused silica,” J. Appl. Phys., 95, 5166 (2004).
S. Nolte, C. Momma, H. Jacobs, et al., “Ablation of metals by ultrashort laser pulses,” J. Optical Soc. Am. B, 14(10), 2716 – 2722 (1997).
P. P. Pronko, S. K. Dutta, J. Squier, et al., “Machining of sub-micron holes using a femtosecond laser at 800 nm,” Optics Comm. 114, 106 (1995).
S. Maruo and S. Kawata, “Three-dimensional microfabrication by use of single-photon-absorbed polymerization,” J. Microelectromech. Syst., 7, 411 (1998).
S. Juodkazis, V. Mizeikis, and H. Misawa, “Three-dimensional microfabrication of materials by femtosecond lasers for photonics applications,” J. Appl. Phys., 106(5), 1101 – 1115 (2009).
D. von der Linde and K. Sokolowski-Tinten, “The physical mechanisms of short-pulse laser ablation,” Appl. Surf. Sci., 154 – 155, 1 – 10 (2000).
N. I. Smith, K. Fujita, O. Nakamura, and S. Kawata, “Generation of calcium waves in living cells by pulsed-laser-induced photodisruption,” Appl. Phys. Lett., 78(8), 1209 – 1210 (2001).
V. Mizeikis, S. Juodkazis, A. Marcinkevièius, et al., “Tailoring and characterization of photonic crystals,” Photochem. Rev., 2(1), 35 – 69 (2001).
H.-B. Sun, Y. Xu, S. Juodkazis, et al., “Arbitrary-lattice photonic crystals created by multiphoton microfabrication,” Opt. Lett., 26(6), 325 – 332 (2001).
X.-Z. Dong, Z. Zhao, X.-M. Duan, and T. Kondo, “Micronanofabrication of assembled three-dimensional microstructures by designable multiple beams multiphoton processing,” Appl. Phys. Lett., 91(12), 4103 (2007).
T. Kaino, “Waveguide fabrication using organic nonlinear optical materials,” J. Opt. A: Pure Appl. Opt. 2(4), R1 – R7 (2000).
M. Miwa, S. Juodkazis, T. Kawakami, et al., “Femtosecond two-photon stereo-lithography,” Appl. Phys. A, 73(5), 561 – 565 (2001).
E. N. Glezer, M. Milosavijevic, L. Huang, et al., “Three-dimensional optical storage inside transparent materials,” Opt. Lett., 21(24), 2023 – 2028 (1996).
M. Watanabe, H.-B. Sun, S. Juodkazis, et al., “Three-dimensional optical data storage in vitreous silica,” Jpn. J. Appl. Phys., 37, L1527 – L1530 (1998).
O. N. Tretyakova and G. Yu. Shevchenko, “Development of control programs for automation of laser-controlled thermal splitting of semiconductor and dielectric materials,” Vest. MAI, 18(6), 53 – 67 (2011).
A. E. Novinskii and G. Yu. Shevchenko, Program for Controlling Laser Processing Equipment for Cutting and Welding: Certificate of State Registration of the Computer Program No. 2013613967. Application No. 2012661679 [in Russian]; received on December 25, 2012; registered in the register of computer programs on April 22, 2013.
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Translated from Steklo i Keramika, No. 12, pp. 27 – 31, December, 2021.
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Kondratenko, V.S., Saprykin, D.L., Tretiyakova, O.N. et al. Investigation of Laser Technology for Cutting Mica. Glass Ceram 78, 486–489 (2022). https://doi.org/10.1007/s10717-022-00437-w
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DOI: https://doi.org/10.1007/s10717-022-00437-w