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Physical origin of spontaneous interfacial alloying in immiscible W/Cu multilayers

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Abstract

A metastable solid solution has been observed in immiscible W/Cu multilayers sputter deposited with very low period (≤3 nm). A recent model evidencing size dependence of surface energies and diffusion coefficients in bilayers may explain the observed trends since diffusion coefficients highly increase when layer thickness decreases. Furthermore, implantation effects of the energetic incoming atoms during layer deposition undoubtedly reinforce these mixing phenomena.

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Acknowledgements

The French authors would like to thank M. Piellard for SEM observations and T. Girardeau for EXAFS experiments and analysis. G. Ouyang and G.W. Yang would like to thank the National Science Foundation of the People’s Republic of China (90306006) and Natural Science Foundation of Guangdong province (01009737) for support of this work.

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Authors and Affiliations

  1. Laboratoire de Métallurgie Physique UMR 6630 CNRS/Université de Poitiers, SP2MI, BP 30179, 86962, Futuroscope Chasseneuil cedex, France

    Pascale Villain, Philippe Goudeau & Frederic Badawi

  2. Sate Key Laboratory of Optoelectronic Materials and Technologies, School of Physics Science and Enguneering, Zhongshan University, Guangzhou, 510275, P.R. China

    G. Ouyang & G. W. Yang

  3. Laboratoire de Mécanique et Physique des Matériaux UMR 6617 CNRS/ENSMA, BP 40109, 86961, Futuroscope Chasseneuil cedex, France

    Véronique Pélosin

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  1. Pascale Villain
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  2. Philippe Goudeau
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  3. Frederic Badawi
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  4. G. Ouyang
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  5. G. W. Yang
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  6. Véronique Pélosin
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Correspondence to Pascale Villain.

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Villain, P., Goudeau, P., Badawi, F. et al. Physical origin of spontaneous interfacial alloying in immiscible W/Cu multilayers. J Mater Sci 42, 7446–7450 (2007). https://doi.org/10.1007/s10853-007-1605-y

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  • DOI: https://doi.org/10.1007/s10853-007-1605-y

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