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High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix

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Abstract

Tungsten coatings with thickness of 5–500 nm are applied onto plane-faced synthetic diamonds with particle sizes of about 430 and 180 μm. The composition and structure of the coatings are investigated using scanning electron microscopy, X-ray spectral analysis, X-ray diffraction, and atomic force microscopy. The composition of the coatings varies within the range W–W2C–WC. The average roughness, R a, of the coatings’ surfaces (20–100 nm) increases with the weight–average thickness of the coating. Composites with a thermal conductivity (TC) as high as 900 W m−1 K−1 are obtained by spontaneous infiltration, without the aid of pressure, using the coated diamond grains as a filler, and copper or silver as a binder. The optimal coating thickness for producing a composite with maximal TC is 100–250 nm. For this thickness the heat conductance of coatings as a filler/matrix interface is calculated as G = (2–10) × 107 W m−2 K−1. The effects of coating composition, thickness and roughness, as well as of impurities, on wettability during the metal impregnation process and on the TC of the composites are considered.

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Notes

  1. Here and below TC is considered at temperature about 300 K.

  2. Numbers written with a slash designate the granulometric composition of the powders; in the first case, in meshes, in the second, in micrometers.

  3. Identification by PDF database: 6-675* diamond, cub. lattice; 4-806* W cub.; 35-776* W2C hex.; 25-1047* WC hex.

  4. Optimal for powder diffractography particle size is several µm.

  5. Thermal resistance is determined as ratio ΔT/q, where ΔT (K) is temperature fall, q (W/m2) is heat flow. Inverse to thermal resistance value G = 1/R is called heat conductance and is measured in W m−2 K−1.

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Acknowledgements

Authors express their appreciation to E.A. Sosnov (St.Petersburg State Institute of Technology) for AFM analysis. Partly this study (S.V. Kidalov and F.M. Shakhov) was supported by the Russian Foundation for Basic Research (RFBR) grant 09-08-01200-a.

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Authors and Affiliations

  1. St. Petersburg State Institute of Technology, Moskovskii pr. 26, Saint-Petersburg, 190013, Russia

    Andrey M. Abyzov

  2. Ioffe Physical-Technical Institute of the Russian Academy of Sciences, 26 Polytekhnicheskaya st, Saint-Petersburg, 194021, Russia

    Sergey V. Kidalov & Fedor M. Shakhov

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  1. Andrey M. Abyzov
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  2. Sergey V. Kidalov
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  3. Fedor M. Shakhov
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Correspondence to Andrey M. Abyzov.

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Abyzov, A.M., Kidalov, S.V. & Shakhov, F.M. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix. J Mater Sci 46, 1424–1438 (2011). https://doi.org/10.1007/s10853-010-4938-x

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