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Light weight high temperature polymer film capacitors with dielectric loss lower than polypropylene

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Abstract

The dielectric and high voltage performance of polymethylpentene (PMP) is investigated and compared with biaxially-oriented polypropylene (BOPP) for high power density and high temperature capacitor applications. PMP has a melting temperature that is around 60 °C higher than BOPP, while still maintaining low dielectric loss and high charge–discharge efficiency that are comparable to the latter. Furthermore, PMP is the lightest commercial thermoplastic polymer with density of 0.83 g/cm3, which is 8 % lower than BOPP (0.9 g/cm3). PMP is a promising semicrystalline dielectric material that may replace BOPP for high temperature pulsed power and power conditioning applications.

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Acknowledgments

This work was supported by the U.S. Office of Naval Research under contract number N00014-13C0234.

Conflict of interest

The authors declare that they have no conflict of interest.

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Authors and Affiliations

  1. PolyK Technologies, LLC, 1981 Pine Hall Road, State College, PA, 16801, USA

    Nanyan Zhang & Shihai Zhang

  2. US Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD, 20783, USA

    Janet Ho

  3. Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, 16802, USA

    James Runt

Authors
  1. Nanyan Zhang
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  2. Janet Ho
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  3. James Runt
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  4. Shihai Zhang
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Correspondence to Janet Ho or Shihai Zhang.

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Zhang, N., Ho, J., Runt, J. et al. Light weight high temperature polymer film capacitors with dielectric loss lower than polypropylene. J Mater Sci: Mater Electron 26, 9396–9401 (2015). https://doi.org/10.1007/s10854-015-3152-7

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  • DOI: https://doi.org/10.1007/s10854-015-3152-7

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