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Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites

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Abstract

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC–Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN–Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K .

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References

  1. X. Huang, G. Liu, X. Wang, Adv. Mater. 24, 1482 (2012)

    Article  CAS  Google Scholar 

  2. K.M.F. Shahil, A.A. Balandin, Nano Lett. 12, 861 (2012)

    Article  CAS  Google Scholar 

  3. A.L. Geiger, D.P.H. Hasselman, K.Y. Donaldson, J. Mater. Sci. Lett. 12, 420 (1993)

    Article  CAS  Google Scholar 

  4. Y.P. Mamunya, V.V. Davydenko, P. Pissis, E.V. Lebedev, Eur. Polym. J. 38, 1887 (2002)

    Article  CAS  Google Scholar 

  5. W.L. Song, P. Wang, L. Cao, A. Anderson, M.J. Meaizni, A.J. Farr, Y.P. Sun, Angew. Chem. Int. Ed. 51, 6498 (2012)

    Article  CAS  Google Scholar 

  6. A. Yu, P. Ramesh, X. Sun, E. Bekyarova, M.E. Itkis, R.C. Haddon, Adv. Mater. 20, 4740 (2008)

    Article  CAS  Google Scholar 

  7. J.A. King, K.W. Tucker, B.D. Vogt, E.H. Weber, C. Quan, Polym. Compos. 20, 643 (1999)

    Article  CAS  Google Scholar 

  8. F. Chavarria, D.R. Paul, Polymer 45, 8501 (2004)

    Article  CAS  Google Scholar 

  9. C. Zhang, W.W. Tjiu, T. Liu, W.Y. Lui, I.Y. Phang, W.D. Zhang, J. Phys. Chem. B 115, 3392 (2011)

    Article  CAS  Google Scholar 

  10. H.W. Starkweather Jr., R.E. Brooks, J. Appl. Polym. Sci. 1, 236 (1959)

    Article  CAS  Google Scholar 

Download references

Acknowledgments

This work was supported by a grant from the Fundamental R&D Program for Technology of World Premier Materials funded by the Ministry of Knowledge Economy (MKE) and was particlly supported by the Institute for Multi-disciplinary Convergence of Materials of the Korea Institute of Science and Technology (KIST) in the Republic of Korea.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul, 120-749, Korea

    Seunggun Yu & Cheolmin Park

  2. Center for Materials Architecturing, Institute for Multi-Disciplinary Convergence of Materials, Korea Institute of Science and Technology (KIST), Hwarangno 14-gil 5, Seongbuk-gu, Seoul, 136-791, Korea

    Seunggun Yu, Do-Kyun Kim, Soon Man Hong & Chong Min Koo

  3. Nanomaterials Science and Engineering, University of Science and Technology, 217 Gajung-ro, Yuseong-gu, Daejeon, 305-350, Korea

    Chong Min Koo

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  1. Seunggun Yu
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  2. Do-Kyun Kim
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  3. Cheolmin Park
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  4. Soon Man Hong
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  5. Chong Min Koo
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Correspondence to Soon Man Hong or Chong Min Koo.

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Yu, S., Kim, DK., Park, C. et al. Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites. Res Chem Intermed 40, 33–40 (2014). https://doi.org/10.1007/s11164-013-1452-1

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  • DOI: https://doi.org/10.1007/s11164-013-1452-1

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