Skip to main content
SpringerLink
Log in

Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers

  • Published:
Journal of Mechanical Science and Technology Aims and scope Submit manuscript

Abstract

3D Molded interconnect device (MID) is referred to as a new paradigm of manufacturing electronic circuits with high design complexity by removing conventional wiring processes. Basically, manufacturing of MIDs consists of several steps: building a structure, creating conductive traces, and pick-and-place of electrical components. A 3D structure was built in a commercial Additive manufacturing (AM) machine, and conductive wires were created using a silver paste on the 3D structure with a predetermined design of an electronic circuit. A Direct-print/cure (DPC) process was developed to draw the conductive wires on the surface and simultaneously harden the created wires using thermal/radiation energy. This DPC system consists of a micro-dispensing device and light focusing module installed in a motorized xyz stage. Resistors were also printed using the developed DPC system and a synthesized carbon nanotube (CNT)/polymer composite. The CNT/polymer composite was characterized through a rheology test and Thermal gravimetric analysis (TGA). The resistance of the printed resistor can be controlled by varying its length and the width. Finally, an automobile cruise controller was fabricated with redesigned circuits for the suggested process and materials, which is a promising technology for building 3D MID parts.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. M. S. Kim, W. S. Chu, Y. M. Kim, A. P. G. Avila and S. H. Ahn, Direct metal printing of 3D electrical circuit using rapid prototyping, International J. of Precision Engineering and Manufacturing, 10 (5) (2009) 147–150.

    Article  Google Scholar 

  2. H. Jung, Y. Kim, S. Kim, J. Jang and J. W. Hahn, Sub-micro to nanometer scale laser direct writing techniques with a contact probe, International J. of Precision Engineering and Manufacturing, 12 (5) (2011) 877–883.

    Article  Google Scholar 

  3. M. I. S. Ismail, Y. Okamoto, A. Okada, Y. Uno and K. Ueoka, Direct micro-joining of flexible printed circuit and metal electrode by pulsed Nd: YAG laser, International J. of Precision Engineering and Manufacturing, 13 (3) (2012) 321–329.

    Article  Google Scholar 

  4. C. M. B. Ho, S. H. Ng and Y. J. Yoon, A review on 3D printed bioimplants, International J. of Precision Engineering and Manufacturing, 16 (5) (2015) 1035–1046.

    Article  Google Scholar 

  5. L. L. Lebel, B. Aissa, A. E. Khakani and D. Therriault, Ultraviolet-assisted direct-write fabrication of carbon nanotube/polymer nanocomposite microcoils, Advanced Material, 22 (5) (2010) 592–596.

    Article  Google Scholar 

  6. F. Medina, A. Lopes, A. Inamdar, R. Hennessey, J. Palmer, B. Chavez, D. Davis, P. Gallegos and R. Wicker, Hybrid manufacturing: integrating direct write and stereolithography, Proc. of the 2005 Solid Freeform Fabrication. J. of Manufacturing Science and Engineering (2005).

    Google Scholar 

  7. A. Pique, S. A. Mathews, B. Pratap, R. C. Y. Auyeung, B. J. Karns and S. Lakeou, Embedding electronic circuits by laser direct-write, Microelectronic Engineering, 83 (11–12) (2006) 2527–2533.

    Article  Google Scholar 

  8. Y. Lu, M. Vatani and J. W. Choi, Direct-write/cure conductive polymer nanocomposites for 3D structural electronics, JMST, 27(10) (2013) 2929–2934.

    Google Scholar 

  9. J. A. Lewis, Direct ink writing of 3D functional materials, Advanced Functional Materials, 16 (2006) 2193–2204.

    Article  Google Scholar 

  10. G. M. Gratson, F. Garcia-Santamaria, V. Lousse, M. Xu, S. Fan, J. A. Lewis and P. V. Braun, Direct-write assembly of three-dimensional photonic crystals: conversion of polymer scaffolds to silicon hollow-woodpile structures, Advanced Materials, 18 (2006) 461–465.

    Article  Google Scholar 

  11. R. A. Barry, R. F. Shepherd, J. N. Hanson, R. G. Nuzzo, P. Wiltzius and J. A. Lewis, Direct-write assembly of 3D hydrogel scaffolds for guided cell growth, Advanced Materials, 21 (23) (2009) 2407–2410.

    Article  Google Scholar 

  12. J. O. Hardin, T. J. Ober, A. D. Valentine and J. A. Lewis, Microfluidic printheads for multimaterial 3D printing of viscoelastic Inks, Advanced Materials, 27 (2015) 3279–3284.

    Article  Google Scholar 

  13. C. Chang, V. H. Tran, J. Wang, Y. K. Fuh and L. W. Lin, Direct-write piezoelectric polymeric nanogenerator with high energy conversion efficiency, Nano Letters, 10 (2) (2010) 726–731.

    Article  Google Scholar 

  14. S. H. Jang, S. T. Oh, I. H. Lee, H-C Kim and H. Y. Cho, 3-dimensional circuit device fabrication process using stereolithography and direct writing, International J. of Precision Engineering and Manufacturing, 16 (7) (2015) 1361–1376.

    Article  Google Scholar 

  15. M. Vatani, Y. Lu, E. D. Engeberg and J-W Choi, Combined 3D printing technologies and material for fabrication of tactile sensors, International J. of Precision Engineering and Manufacuring, 16 (7) (2015) 1375–1383.

    Article  Google Scholar 

  16. Y-W. Park, O-K Oh and M. D. Noh, Ejection feasibility of high viscosity fluid with magnetostrictive inkjet printhead, International J. of Precision Engineering and Manufacuring, 16 (7) (2015) 1369–1374.

    Article  Google Scholar 

  17. B. J. Tricomi, M. S. Ozturk, X. Intes and D. T. Corr, Biofabrication and 3D localization of multilayered cellular constructs using laser direct-write and mesoscopic fluorescent molecular tomography, Biomedical Engineering Conference (NEBEC), 41st Annual Northeast. IEEE (2015).

    Google Scholar 

  18. D. M. Kingsley, A. D. Dias, D. B. Chrisey and D. T. Corr, Single-step laser-based fabrication and patterning of cellencapsulated alginate microbeads, Biofabrication, 5 (4) (2013) 045006.

    Article  Google Scholar 

  19. D. Unnikrishnan, D. Kaddour, S. Tedjini, E. Bihar and M. Saadaoui, CPW-fed inkjet printed UWB antenna on ABSPC for integration in molded interconnect devices technology, IEEE Antennas and Wireless Propagation Letters, 14 (2015).

  20. P. Amend, C. Pscherer, T. Rechtenwald, T. Frick and M. Schmidt, A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology, Physics Procedia, 5 (2010) 516–572.

    Article  Google Scholar 

  21. A. Islam, H. N. Hansen and N. Giannekas, Quality investigation of miniaturized molded interconnect devices (MIDs) for hearing aid applications, CIRP Annals-Manufacturing Technology, 64 (2015) 539–544.

    Article  Google Scholar 

  22. M. S. Kim, J. Yan, K. M. Kang, K. H. Joo, Y. J. Kang and S. H. Ahn, Soundproofing ability and mechanical properties of polypropylene/exfoliated graphite nanoplatelet/carbon nanotube (PP/xGnP/CNT) composite, International J. of Precision Engineering and Manufacturing, 14 (6) (2013) 1087–1092.

    Article  Google Scholar 

  23. Y. C. Shin, E. Novin and H. Kim, Electrical and thermal conductivities of carbon fiber composites with high concentrations of carbon nanotubes, International J. of Precision Engineering and Manufacturing, 16 (3) (2015) 465–470.

    Article  Google Scholar 

  24. L. Yoo and H. Kim, Conductivities of graphite fiber composites with single-walled carbon nanotube layers, International J. of Precision Engineering and Manufacturing, 12 (4) (2011) 745–748.

    Article  Google Scholar 

  25. J. W. Park, B. H. Kim, J. G. Ok, W. J. Kim, Y. H. Kim and C. N. Chu, Wire electrical discharge machining of carbon nanofiber mats for field emission, International J. of Precision Engineering and Manufacturing, 13 (4) (2012) 593–599.

    Article  Google Scholar 

  26. M. Vatani, Y. Lu, K. S Lee, H. C. Kim and J. W. Choi, Direct-write stretchable sensors using single-walled carbon nanotubes/polymer matrix, J. of Electronic Packaging, 135 (1) (2013).

    Google Scholar 

  27. I. N. Ali, Y. Takeo, N. F. Don, Y. Masako, T. Hideyuki, H. Hiroaki, I. Sumio and T. Kenji, High-power supercapacitor electrodes from single-walled carbon nanohorn/nanotube composite, ACSNANO, 5 (2) (2011) 811–819.

    Google Scholar 

  28. J. H. Sandoval, K. F. Soto, L. E. Murr and R. B. Wicker, Nanotailoring photocrosslinkable epoxy resins with multiwalled carbon nanotubes for stereolithography layered manufacturing, J. of Material Science, 42 (1) (2007) 156–165.

    Article  Google Scholar 

  29. L. Nougaret, H. Happy, G. Dambrine, V. Derycke, J. P. Bourgoin, A. A. Green and M. C. Hersam, 80 GHz fieldeffect transistors produced using high purity semiconducting single-walled carbon nanotubes, Applied Physics Letters, 94 (243505) (2009).

  30. A. Javey, J. Guo, Q. Wang, M. Lundstrom and H. Dai, Ballistic carbon nanotube field-effect transistors, Nature, 424 (2003) 654–657.

    Article  Google Scholar 

  31. M. Engel, J. P. Small, M. Steiner, M. Freitag, A. A. Green, M. C. Hersam and P. Avouris, Thin film nanotube transistors based on self-assembled, aligned, semiconducting carbon nanotube arrays, ACSNANO, 2 (12) (2008) 2445–2452.

    Google Scholar 

  32. M. M. Shokrieh and R. Rafiee, A Review of the mechanical properties of isolated carbon nanotubes and carbon nanotube composites, Mechanics of Composite Materials, 46 (2) (2011) 155–172.

    Article  Google Scholar 

  33. Y. Lu, M. Vatani, H. C. Kim, R. C. Lee and J. W. Choi, Development of direct printing/curing process for 3d structural electronics, International Mechanical Engineering Congress and Exposition, American Society of Mechanical Engineers (2013) (V02AT02A005-V02AT02A005).

    Google Scholar 

  34. M. W. Sa and J. Y. Kim, Effect of various blending ratios on the cell characteristics of PCL and PLGA scaffolds fabricated by polymer deposition system, International J. of Precision Engineering and Manufacturing, 14 (4) (2013) 649–655.

    Article  Google Scholar 

  35. S. Fathi, P. Dickens and F. Fouchal, Regimes of droplet train impact on a moving surface in an additive manufacturing process, J. of Materials Processing Technology, 210 (3) (2009) 550–559.

    Article  Google Scholar 

  36. M. Vatani, E. D. Engeberg and J. W. Choi, Force and slip detection with direct-write compliant tactile sensors using multi-walled carbon nanotube/polymer composites, Sensors and Actuators, A: Physical, 195 (1) (2013) 90–97.

    Google Scholar 

  37. E. C. Jeon, J. R. Lee, T. J. Je, D. S. Choi, Y. B. Ham, E. S. Lee, S. K. Choi and H. Kim, Quantitative analysis on airdispensing parameters for manufacturing dome lenses of chip-on-board LED system, International J. of Precision Engineering and Manufacturing, 15 (11) (2014) 2437–2441.

    Article  Google Scholar 

  38. S. Barrau et al., DC and AC conductivity of carbon nanotubes-polyepoxy composite, Macromolecules, 36 (14) (2003) 5187–5194.

    Article  Google Scholar 

  39. C. Li, E. T. Thostenson and T. W. Chou, Dominant role of tunneling resistance in the electrical conductivity of carbon nanotube-based composites, Applied Physics Letters, 91 (223114) (2007).

Download references

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, The University of Akron, Akron, Ohio, 44325, USA

    Yanfeng Lu, Morteza Vatani & Jae-Won Choi

  2. Department of Mechanical and Automotive Engineering, Andong National University, 1375 Gyeongdong-ro, Andong-si, Gyeoungbuk-do, 760-749, Korea

    Hae-Yong Yun & Ho-Chan Kim

Authors
  1. Yanfeng Lu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hae-Yong Yun
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Morteza Vatani
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Ho-Chan Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Jae-Won Choi
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Ho-Chan Kim or Jae-Won Choi.

Additional information

Recommended by Editor Haedo Jeong

Yanfeng Lu is a Ph.D. candidate in the Department of Mechanical Engineering at University of Akron. He received his M.S. and B.S degrees in the School of Mechanical Engineering and School of Chemical Engineering from Dalian University of Technology (DUT), China in 2011 and 2007, respectively. His current research interests include the direct-print/cure system, 3D structural electronics, and micro Additive Manufacturing.

Hae-Yong Yun is a Ph.D. candidate in the Department of Automotive and Mechanical Engineering at Andong National University. He received a B.S. and M.S. from Andong National University. His current research includes Molded Interconnect Devices (MIDs) and 3D Printing and Additive Manufacturing.

Morteza Vatani is currently a Ph.D. candidate in Mechanical Engineering at the University of Akron. He received his M.S. in Mechanical Engineering/ Manufacturing from Amirkabir University of Technology in Iran in 2009. His current research focuses on developing stretchable piezoresistive sensing material and developing a hybrid direct writeadditive manufacturing system.

Ho-Chan Kim is an Associate Professor in the Department of Automotive and Mechanical Engineering at Andong National University. He received his B.S., M.S., and Ph.D. from Pusan National University in 1996, 1998, and 2003, respectively. His current research interests include 3D structural electronics, 3D Printing and Additive Manufacturing, and Manufacturing Information.

Jae-Won Choi is an Assistant Professor in the Department of Mechanical Engineering at the University of Akron (UA). His B.S., M.S., and Ph.D. were obtained from Pusan National University (PNU) in South Korea in 1999, 2001, and 2007, respectively, with a strong background of advanced manufacturing technologies. His research interests include advanced multi-scale, multimaterial additive manufacturing, stretchable sensors, tissue engineering, biomedical devices, transdermal drug delivery, 3D electronics, and direct writing.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lu, Y., Yun, HY., Vatani, M. et al. Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers. J Mech Sci Technol 29, 5377–5385 (2015). https://doi.org/10.1007/s12206-015-1139-1

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12206-015-1139-1

Keywords

Search

Navigation