Abstract
In this paper, we have studied the thermal stability of GNR and Cu interconnects for terahertz frequency range. The top-contact (TC) and side-contact (SC) GNR interconnects are analyzed for stability, RC-delay, and power consumption at different interconnect lengths (\(10\,{\upmu }\hbox {m}\), \(50\,{\upmu }\hbox {m}\) and \(100\,{\upmu }\hbox {m}\)) and different chip operating temperatures (233 K, 300 K and 378 K). The RC-delay and power consumption are analyzed with the help of transmission line model (TLM) using 16nm PTM-HP standard CMOS model. In our analysis, we have shown that the RC-time constant for SC-GNR is \(\sim (3{-}7)\times \) and \(\sim (2{-}6)\times \) less than that of TC-GNR and Cu interconnects. Similarly, we have shown that the power consumption for SC-GNR is \(\sim (4{-}7)\times \) and \(\sim (2{-}5)\times \) less than that of TC-GNR and Cu. In terms of stability, SC-GNR interconnect is more stable at higher frequency range (\(>10^{12}\) Hz) compared with TC-GNR and Cu for \(10\,{\upmu }\hbox {m}\) interconnect length and three different chip operating temperatures.
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This work is partially supported by the UGC, MRP, Government of India.
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Das, S., Bhattacharya, S., Das, D. et al. Thermal Stability Analysis of Graphene Nano-ribbon Interconnect and Applicability for Terahertz Frequency. Natl. Acad. Sci. Lett. 43, 253–257 (2020). https://doi.org/10.1007/s40009-019-00854-6
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DOI: https://doi.org/10.1007/s40009-019-00854-6