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Multi-dimensional electrostatic plasma simulations using the particle-in-cell method for the low-temperature plasmas for materials processing

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Abstract

With the increasing requirement for the analysis of nonlinear and transient behaviors in plasma systems, the demand for particle-in-cell (PIC) simulations is increasing. However, most plasma simulations have utilized fluid models because of the high computational cost of the PIC simulation. This article introduces the most recent advances in the electrostatic particle-in-cell simulations of low-temperature plasmas for materials processing. The parallelization in multi-dimensional geometry using heterogeneous computing and the method to treat curved boundaries are explained to improve the PIC simulation. Test examples of two-dimensional hollow cathode discharges and three-dimensional magnetron sputtering systems are presented to investigate the kinetic effects of the system.

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Acknowledgments

This work was supported by Samsung Electronics Company, Ltd., Memory Department, Etch Technology Team.

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Authors and Affiliations

  1. Department of Electrical Engineering, Pusan National University, Busan, 46241, South Korea

    Young Hyun Jo, Cheongbin Cheon, Heesung Park & Hae June Lee

  2. Mechatronic R&D Center, Samsung Electronics Company, Ltd., Suwon, 16677, South Korea

    Young Hyun Jo & Min Young Hur

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  1. Young Hyun Jo
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  2. Cheongbin Cheon
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  3. Heesung Park
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  4. Min Young Hur
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  5. Hae June Lee
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Correspondence to Hae June Lee.

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Jo, Y.H., Cheon, C., Park, H. et al. Multi-dimensional electrostatic plasma simulations using the particle-in-cell method for the low-temperature plasmas for materials processing. J. Korean Phys. Soc. 80, 787–798 (2022). https://doi.org/10.1007/s40042-021-00375-w

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  • DOI: https://doi.org/10.1007/s40042-021-00375-w

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