Skip to main content
SpringerLink
Log in

Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height

  • Research Paper
  • Published:
Welding in the World Aims and scope Submit manuscript

Abstract

Lead-free “copper wire/Sn-3.0Ag-0.5Cu (SAC305) solder/copper wire” sandwich-structured micro-scale solder joints with a constant diameter (d = 400 μm) and various heights (125, 225, and 325 μm) were adopted to carried out the mechanical behavior research. Experimentally, quasi-static shear and tensile experiments were conducted by using a precision dynamic mechanics analyzer (DMA Q800). Then, the micro-scale solder joint model was built to simulate shear and tensile behavior of solder joints using the finite element analysis software ABAQUS. The experimental results show that, when the solder joint diameter is fixed, the smaller the joint height is, the stronger the shear strength and tensile strength. Under the same test conditions (225 μm), the shear strength of micro-scale solder joints of the same size is lower than the tensile strength, which indicates that the service environment of electronic packaging interconnection solder joints under shear stress is more severe. In addition, the micro-scale solder joints fracture at the interface of the solder joint and copper wire under shear force, but in the middle of the solder joint under tensile force. Different fracture failure mechanisms are found by observing the cross sections under different stress states.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. Tu KN (2003) Recent advances on electromigration in very-large-scale-integration of interconnects. J Appl Phys 94(9):5451–5473. https://doi.org/10.1063/1.1611263

    Article  CAS  Google Scholar 

  2. Fortier A, Pecht M (2017) A perspective of the IPC report on lead-free electronics in military/aerospace applications. Microelectron Reliab 69:66–70. https://doi.org/10.1016/j.microrel.2017.01.001

    Article  Google Scholar 

  3. Zhang L, Han J, He C, Guo Y (2013) Reliability behavior of lead-free solder joints in electronic components. J Mater Sci Mater Electron 24(1):172–190. https://doi.org/10.1007/s10854-012-0720-y

    Article  CAS  Google Scholar 

  4. Kong X, Sun F, Yang M (2018) Analysis of creep performance of micro solder joints under different loading mode. Chin. J Mater Res. 32(3):184–190. https://doi.org/10.11901/1005.3093.2018.124

    Article  Google Scholar 

  5. Pecht M, Shibutani T, Wu L (2016) A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. Microelectron Reliab 62(62):113–123. https://doi.org/10.1016/j.microrel.2016.03.020

    Article  Google Scholar 

  6. Zimprich P, Betzwarkotas A, Khatibi G, Weiss B, Ipser H (2008) Size effects in small scaled lead-free solder joints. J Mater Sci Mater Electron 19(4):383–388. https://doi.org/10.1007/s10854-007-9349-7

    Article  CAS  Google Scholar 

  7. Orowan E (1949) Fracture and strength of solids. Rep Prog Phys 12(1):185–232. https://doi.org/10.1088/0034-4885/12/1/309

    Article  Google Scholar 

  8. Lee B, Yoon J (2018) Cu-Sn intermetallic compound joints for high-temperature power electronics applications. J Electron Mater 47(1):430–435. https://doi.org/10.1007/s11664-017-5792-2

    Article  CAS  Google Scholar 

  9. Qin H, Zhang X, Zhou M, Zeng J, Mai Y (2014) Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints. Mat Sci Eng A-Struct 617:14–23. https://doi.org/10.1016/j.msea.2014.08.008

    Article  CAS  Google Scholar 

  10. Li B, Zhang X, Yang Y, Yin L, Pecht M (2013) Size and constraint effects on interfacial fracture behavior of microscale solder interconnects. Microelectron Reliab 53(1):154–163. https://doi.org/10.1016/j.microrel.2012.07.033

    Article  CAS  Google Scholar 

  11. Cho Y, Jang J, Jang G (2018) Sensitivity analysis on the fatigue life of solid state drive solder joints by the finite element method and Monte Carlo simulation. Microsyst Technol 24(11):4669–4676. https://doi.org/10.1007/s00542-018-3819-0

    Article  Google Scholar 

  12. He X, Yao Y (2017) A dislocation density based viscoplastic constitutive model for lead free solder under drop impact. Int J Solids Struct 120:236–244. https://doi.org/10.1016/j.ijsolstr.2017.05.005

    Article  CAS  Google Scholar 

  13. An T, Qin F, Li J (2010) Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron Reliab 51(5):1011–1019. https://doi.org/10.1016/j.microrel.2010.12.009

    Article  CAS  Google Scholar 

  14. Yao Y, Fry J, Fine ME, Keer LM (2013) The Wiedemann–Franz–Lorenz relation for lead-free solder and intermetallic materials. Acta Mater 61(5):1525–1536. https://doi.org/10.1016/j.actamat.2012.11.030

    Article  CAS  Google Scholar 

  15. Johnson GR, Cook WH (1985) Fracture characteristics of three metals subjected to various strains, strain rates, temperatures and pressures. Eng Fract Mech 21(1):31–48. https://doi.org/10.1016/0013-7944(85)90052-9

    Article  Google Scholar 

  16. Wong EH, Chrisp J, Selvanayagam CS, Seah SK (2016) Constitutive modeling of solder alloys for drop-impact applications. Microelectron Reliab 67:135–142. https://doi.org/10.1016/j.microrel.2016.10.007

    Article  CAS  Google Scholar 

  17. Qin F, An T, Chen N (2010) Strain rate effects and rate-dependent constitutive models of lead-based and lead-free solders. J Appl Mech 77(1):1008. https://doi.org/10.1115/1.3168600

    Article  CAS  Google Scholar 

  18. Kim J, Jung S (2007) Design of solder joint structure for flip chip package with an optimized shear test method. J Electron Mater 36(6):690–696. https://doi.org/10.1007/s11664-007-0140-6

    Article  CAS  Google Scholar 

  19. Yin L, Zhang X, Lu C (2009) Size and volume effects on the strength of microscale lead-free solder joints. J Electron Mater 38(10):2179–2183. https://doi.org/10.1007/s11664-009-0858-4

    Article  CAS  Google Scholar 

Download references

Funding

This research was supported by the National Natural Science Foundation of China (No. 51674056), the Frontier and Applied Basic Research Projects of Chongqing (Nos. cstc2018jcyjAX0108 and cstc2019jcyj-msxmX0175), the University Outstanding Achievement Transformation Project of Chongqing (No. KJZH17137), and the Opening Project of Guangdong Provincial Key Laboratory of Modern Welding Technology (No. 2018002).

Author information

Authors and Affiliations

  1. School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing, 401331, China

    Limeng Yin, Cunguo Zuo, Zhongwen Zhang, Gang Wang, Zongxiang Yao & Zilong Su

  2. Guangdong Provincial Key Laboratory of Modern Welding Technology, Guangdong Welding Institute (China-Ukraine E.O. Paton Institute of Welding), Guangzhou, 510650, China

    Limeng Yin

  3. Harbin Welding Institute Limited Company, Harbin, 150028, China

    Naiwen Fang

Authors
  1. Limeng Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Cunguo Zuo
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Zhongwen Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Gang Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Zongxiang Yao
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Zilong Su
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Naiwen Fang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Limeng Yin.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yin, L., Zuo, C., Zhang, Z. et al. Experimental and numerical simulation of mechanical behavior of micro-scale SAC305 solder joint based on joint height. Weld World 64, 2101–2108 (2020). https://doi.org/10.1007/s40194-020-00985-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40194-020-00985-1

Keywords

Search

Navigation