Abstract
The NiFe/Cu/IrMn heterostructures with a variable number of interlayer Cu atoms exhibit a sharp change in the exchange-bias field, the coercive force, and the unidirectional anisotropy field at an effective copper layer thickness tCu ≈ 0.5 nm, which corresponds to incomplete coverage of the interface, i.e., to an island deposited structure. The symmetry of the angular dependence of the ferromagnetic resonance changes sharply at an incompletely coated interface (tCu = 0.5 nm), which corresponds to a transition from isolated islands to a magnetic fractal structure. This phenomenon, which can be called a “magnetic” percolation threshold is not related to the electrical resistance of the heterostructure, which decreases sharply at a significantly larger effective threshold copper layer thickness (tCu = 1.3 nm) when the interface is completely covered.
Similar content being viewed by others
REFERENCES
V. Baltz, A. Manchon, M. Tsoi, T. Moriyama, T. Ono, and Y. Tserkovnyak, Rev. Mod. Phys. 90, 015005 (2018).
J. Y. Son, C. H. Kim, J. H. Cho, Y. H. Shin, and H. M. Jang, ACS Nano 4, 3288 (2010).
J. McCord, R. Mattheis, and D. Elefant, Phys. Rev. B 70, 094420 (2004).
R. Stamps, J. Phys. D 33, R247 (2000).
P. K. Manna and S. M. Yusuf, Phys. Rep. 535, 61 (2014).
Y. Hu, X. Li, X. Chi, A. Du, and F. Shi, J. Phys. D 51, 055001 (2018).
T. R. Gao, Z. Shi, S. M. Zhou, R. Chantrell, P. Asselin, X. J. Bai, J. Du, and Z. Z. Zhang, J. Appl. Phys. 105, 053913 (2009).
H. S. Jung, O. Traistaru, and H. Fujiwara, J. Appl. Phys. 95, 6849 (2004).
H. Sang, Y. W. Du, and C. L. Chien, J. Appl. Phys. 85, 4931 (1999).
J. Camarero, J. Sort, A. Hoffmann, J. M. Garcia-Martin, B. Dieny, R. Miranda, and J. Nogues, Phys. Rev. Lett. 95, 057204 (2005).
S. H. Chung, A. Hoffmann, and M. Grimsditch, Phys. Rev. B 71, 214430 (2005).
J. P. King, J. N. Chapman, M. F. Gillies, and J. C. S. Kools, J. Phys. D 34, 528 (2001).
T. Q. Hung, S. Oh, B. Sinha, J. R. Jeong, D. Y. Kim, and C. Kim, J. Appl. Phys. 107, 09E715 (2010).
L. Thomas, A. J. Kellock, and S. S. P. Parkin, J. Appl. Phys. 87, 5061 (2000).
S. Nicolodi, L. C. C. M. Nagamine, A. D. C. Viegas, J. E. Schmidt, L. G. Pereira, C. Deranlot, F. Petroff, and J. Geshev, J. Magn. Magn. Mater. 316, e97 (2007).
J. Sort, F. Garcia, B. Rodmacq, S. Auffret, and B. Dieny, J. Magn. Magn. Mater. 272, 355 (2004).
L. N. Maskaeva, E. A. Fedorova, and V. F. Markov, Thin Film and Coating Technology (Ural. Univ., Yekaterinburg, 2019) [in Russian].
C. W. Nan, Y. Shen, and J. Ma, Ann. Rev. Mater. Res. 40, 131 (2010).
K. Li, Z. Guo, G. Han, J. Qiu, and Y. Wu, J. Appl. Phys. 93, 6614 (2003).
N. J. Gokemeijer, T. Ambrose, and C. Chien, Phys. Rev. Lett. 79, 4270 (1997).
M. Gruyters, M. Gierlings, and D. Riegel, Phys. Rev. B 64, 132401 (2001).
I. J. Youngs, J. Phys. D 35, 3127 (2002).
Q. Li, T. Li, and J. Wu, J. Colloid Interface Sci. 239, 522 (2001).
N. I. Lebovka, S. Tarafdar, and N. V. Vygornitskii, Phys. Rev. E 73, 031402 (2006).
D. S. McLachlan, C. Chiteme, W. D. Heiss, and J. Wu, Phys. B (Amsterdam, Neth.) 338, 261 (2003).
W. Z. Cai, S. T. Tu, and J. M. Gong, J. Comp. Mater. 40, 2131 (2006).
D. S. McLachlan, K. Cai, and G. Sauti, Int. J. Refract. Met. Hard Mater. 19, 437 (2001).
M. Sahimi, Phys. Rep. 306, 213 (1998).
J. Geshev, S. Nicolodi, L. G. Pereira, L. C. C. M. Nagamine, and J. E. Schmidt, Phys. Rev. B 75, 214402 (2007).
Y. G. Yoo, M. C. Paek, S. G. Min, and S. C. Yu, J. Magn. Magn. Mater. 290, 198 (2005).
Y. G. Yoo, S. G. Min, and S. C. Yu, J. Magn. Magn. Mater. 304, e718 (2006).
A. Elzwawy, A. Talantsev, and C. Kim, J. Magn. Magn. Mater. 458, 292 (2018).
R. B. Morgunov, M. V. Bakhmet’ev, and A. D. Talantsev, Phys. Solid State 62, 1991 (2020).
T. R. McGuire and R. I. Potter, IEEE Trans. Magn. 11, 1018 (1975).
P. P. Shinde, P. Tagade, S. P. Adiga, A. Konar, S. Pandian, and K. S. Mayya, Phys. Rev. B 102, 165102 (2020).
R. B. Morgunov, A. I. Dmitriev, Y. Tanimoto, J. S. Kulkarni, J. D. Holmes, and O. L. Kazakova, Phys. Solid State 50, 1103 (2008).
W. Alayo, F. Pelegrini, and E. Baggio-Saitovitch, J. Magn. Magn. Mater. 377, 104 (2015).
J. Lindner and K. Baberschke, J. Phys.: Condens. Matter 15, R193 (2003).
V. G. Myagkov, L. E. Bykova, V. Yu. Yakovchuk, A. A. Matsynin, D. A. Velikanov, G. S. Patrin, G. Yu. Yurkin, and G. N. Bondarenko, JETP Lett. 105, 651 (2017).
ACKNOWLEDGMENTS
We thank Prof. C. Kim (Institute of Science and Technologies, South Korea) for supplying the samples for investigation.
Funding
This work was supported by grant NSh-2644.2020.2 of the President of the Russian Federation for state support of leading scientific schools in terms of program AAAA-A19-119092390079-8 of the Institute of Problems of Chemical Physics, Russian Academy of Sciences.
The development of the software package for the Monte Carlo simulation of nanolayer deposition was supported by National Research Foundation of the Republic of Korea (NRF), grant no. NRF-2018R1A5A1025511 of the Government of the Republic of Korea (MSIT).
Author information
Authors and Affiliations
Corresponding author
Additional information
Translated by K. Shakhlevich
Rights and permissions
About this article
Cite this article
Bakhmet’ev, M.V., Talantsev, A.D. & Morgunov, R.B. Sharp Change in the Exchange Bias and the Magnetic Anisotropy Symmetry at a Subthreshold Interlayer Copper Content in NiFe/Cu/IrMn Heterostructures. J. Exp. Theor. Phys. 132, 852–864 (2021). https://doi.org/10.1134/S1063776121050010
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1063776121050010