Abstract
The triple junction features of 0.5 wt.% Si electrical steel in electrically assisted forming were investigated. Specimens were electrically stretched, measured with electron backscatter diffraction (EBSD) method. The results show triple junction curvature, and the difference between the maximum and minimum dihedral angles and specific triple junctions are promoted. It is concluded that increased deviation from the equilibrium of dihedral angles can be attributed to the increased triple junction curvature induced by electric current. The increased triple junction curvature enhances the driving force for triple junction motion and reduces the retarding effect of particles on the motion of triple junctions.
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References
A.-H. Chen, H.-R. Guo, H.-L. Li, T. Emi, Formation of edge crack in 14% Si non-oriented electrical steel during hot rolling. J. Iron. Steel. Res. Int. 21, 269 (2014)
M.H. Han, S. Lee, N.J. Kim, K.J. Lee, T. Chung, G. Byun, Analysis and prevention of edge cracking phenomenon during hot rolling of non-oriented electrical steel sheets. Mater. Sci. Eng. A 264, 47 (1999)
Z.S. Xu, Z.H. Lai, Y.X. Chen, Effect of electric current on the recrystallization behavior of cold worked alpha-Ti. Scripta Metall. 22, 187 (1988)
A. Hosoi, T. Nagahama, Y. Ju, Fatigue crack healing by a controlled high density electric current field. Mater. Sci. Eng. A 533, 38 (2012)
S. Kobayashi, T. Inomata, H. Kobayashi, S. Tsurekawa, T. Watanabe, Effects of grain boundary and triple junction-character on intergranular fatigue crack nucleation in polycrystalline aluminum. J. Mater. Sci. 43, 3792 (2008)
E.M. Lehockey, G. Palumbo, P. Lin, Grain boundary structure effects on cold work embrittlement of microalloyed steels. Scripta Mater. 39, 353 (1998)
O.K. Johnson, C.A. Schuh, The uncorrelated triple junction distribution function: Towards grain boundary network design. Acta Mater. 61, 2863 (2013)
L.S. Shvindlerman, G. Gottstein, Grain boundary and triple junction migration. Mater. Sci. Eng. A 302, 141 (2001)
G. Gottstein, A.H. King, L.S. Shvindlerman, The effect of triple-junction drag on grain growth. Acta Mater. 48, 397 (2000)
S.-C. Lin, M.-W. Liu, M.P. Gururajan, Wu. Kuo-An, Modified Young’s equation for equilibrium dihedral angles of grain boundary grooves in thin films at the nanoscale. Acta Mater. 102, 364 (2016)
R.A. Marks, A.M. Glaeser, Equilibrium and stability of triple junctions in anisotropic systems. Acta Mater. 60, 349 (2012)
A.H. King, The Geometric and Thermodynamic Properties of Grain Boundary Junctions. Interface Sci. 7, 251 (1999)
G. Gottstein, L.S. Shvindlerman, Triple junction drag and grain growth in 2D polycrystals. Acta Mater. 50, 703 (2002)
B. Zhao, G. Gottstein, L.S. Shvindlerman, Triple junction effects in solids. Acta Mater. 59, 3510 (2011)
M.E. Gurtina, L. Anand, Nanocrystalline grain boundaries that slip and separate: A gradient theory that accounts for grain-boundary stress and conditions at a triple-junction. J. Mech. Phys. Solids 56, 184 (2008)
E.N. Borodina, V. Bratovb, Non-equilibrium approach to prediction of microstructure evolution for metals undergoing severe plastic deformation. Mater. Charact. 141, 267 (2018)
J. Tyler, Effect of power supply type on the electroplastic effect. J. Manuf. Process 56, 1263 (2020)
F. Bachmann, R. Hielscher, P.E. Jupp, W. Pantleon, H. Schaeben, E. Wegert, Inferential statistics of electron backscatter diffraction data from within individual crystalline Grains. J. Appl. Cryst. 43, 1338 (2010)
J.E. Burke, D. Turnbull, Recrystallization and grain growth. Prog. Met. Phys. 3, 220 (1952)
B. Zhao, JCh. Verhasselt, L.S. Shvindlerman, G. Gottstein, Measurement of grain boundary triple line energy in copper. Acta Mater. 58, 5646 (2010)
S.G. Protasova, G. Gottstein, D.A. Molodov, V.G. Sursaeva, L.S. Shvindlerman, Triple junction motion in aluminum tricrystals. Acta Mater. 49, 2519 (2001)
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Ye, B., Li, L. The triple junction features of 0.5 wt.% Si electrical steel in electrically assisted forming. MRS Communications 11, 831–837 (2021). https://doi.org/10.1557/s43579-021-00105-0
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DOI: https://doi.org/10.1557/s43579-021-00105-0