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Digital Health and Bio-Medical Packaging

  • Chapter
Materials for Advanced Packaging

Abstract

This chapter reviews the healthcare trends and implications, as well as electronic packaging applications in implantable devices, pacing leads, bio-medical sensors, and point-of-care sensors. Each presents unique opportunities and challenges for electronic packaging and materials.

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Author information

Authors and Affiliations

  1. Neuromodulation, Medtronic, Inc, 4000 Lexington Ave N, 55126, Shoreview, MN, USA

    Lei Mercado

  2. Cardiac Rhythm and Disease Management, Medtronic, Inc, 8200 Coral Sea St. NE, 55112, Mounds View, MN, USA

    James K. Carney Ph.D., Michael J. Ebert Ph.D. & Scott A. Hareland Ph.D.

  3. Micro and Nanotechnology Laboratory, Department of Electrical and Computer Engineering and Department of BioEngineering, University of Illinois at Urbana-Champaign, 2000 Micro and Nanotechnology Laboratory, MC-249, University of Illinois at Urbana-Champaign, 208 North Wright Street, 61801, Urbana, Illinois, USA

    Rashid Bashir Ph.D.

Authors
  1. Lei Mercado
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  2. James K. Carney Ph.D.
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  3. Michael J. Ebert Ph.D.
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  4. Scott A. Hareland Ph.D.
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  5. Rashid Bashir Ph.D.
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Corresponding author

Correspondence to Lei Mercado .

Editor information

Editors and Affiliations

  1. Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China

    Daniel Lu

  2. Georgia Institute of Technology, Atlanta, GA, USA

    C.P. Wong

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Mercado, L., Carney, J.K., Ebert, M.J., Hareland, S.A., Bashir, R. (2009). Digital Health and Bio-Medical Packaging. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_19

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