The use of alkali glass in micromechanical sensors, specifically, accelerometers, is shown. Alkali glass is used in the sensitive elements of the indicated devices. The main technological operation in the assembly of such sensitive elements is electrostatic bonding, also known as the anodic bonding. In this process a number of complex physical effects occur in the glass. Reliable functioning of the fabricated devices depends on the quality of the execution of the parts made of alkali glass and silicon.
Similar content being viewed by others
References
GOST R 8.596–2002. State System Ensuring Traceability of Measurements. Metrological Provision of Measuring Systems. The Main Provisions [in Russian], Standardinform, Moscow (2002).
E. A. Mokrov and A. A. Papko, “Accelerometers of the Research Institute for Physical Measurements—elements of microsystem engineering,” Mikrosistemnaya Tekhnika, No. 1, 3 (2002).
S. A. Kozin, A. V. Fedulov, and V. E. Pautkin, “Development of technology and special equipment for joining silicon with glass in a high-voltage field,” Datchiki i Sistemy, No. 9, 46 – 47 (2005).
N. L. Glinka, General Chemistry [in Russian], Yurait, Moscow (2015).
B. M. Yavorskii and A. A. Detlaf, Physics Handbook for Engineers and University Students [in Russian], Oniks, Moscow (2006).
A. N. Tabenkin, S. B. Tarasov, and S. N. Stepanov, Roughness, Waviness, Profile: International Experience [in Russian], Izd. Politekh. Univer., St. Petersburg (2007).
E. P. Prokop’ev, S. P. Timoshenkov, A. L. Suvorov, et al., Features of the Technology for Manufacturing SOI Structures by Direct Splicing and Quality Control of Silicon Wafers [in Russian], Institute of Theoretical and Experimental Physics, Moscow (2000).
Author information
Authors and Affiliations
Corresponding author
Additional information
Translated from Steklo i Keramika, No. 4, pp. 28 – 31, April, 2019.
Rights and permissions
About this article
Cite this article
Pautkin, V.E. Use of Alkaline Glass in Micromechanical Sensor Structures. Glass Ceram 76, 142–144 (2019). https://doi.org/10.1007/s10717-019-00151-0
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10717-019-00151-0