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Current Status of LSI Micro-fabrication and Future Prospect for 3D System Integration

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Abstract

Micro-fabrication technology for LSI devices has been progressing technically over time. However, the scenario of continuing to produce ever-finer feature geometries has a low probability. Resolution capabilities will reach a critical limit due to conventional CMOS performance threshold and chip economy. Therefore, to assure continued performance improvements for future devices, front-end fabricators should consider a new 3 dimensional structure (3D-LSI) using a “Through-Si-Via” process. At the same time, the definition of the semiconductor device should be updated to “System & Design Integration (S&DI).” S&DI will provide the needed feedback to launch a new field of clear applications, based on a total system solution with innovative design, fabrication, inspection and evaluation equipment. 3D-LSI and S&DI will have a tremendous impact on the future electronics industries.

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References

  1. R. H. Dennard et al, IEEE J. Solid-State Circuits, SC-9, 256 (1974).

    Article  Google Scholar 

  2. Available: Intel Developer Forum Fall 2006.

  3. H. Iwai, STARC Symposium, pp.27, 2002.

  4. H. Wakabayashi et.al., IEDM Tech. Dig., pp.989, 2003.

  5. A.V-Y. Thean et. al., Symp. on VLSI Technology., pp.164, 2006.

  6. X. Chen et.al., Symp. on VLSI Technology., pp.74, 2006.

  7. Available: http://www.itrs.net.

  8. W. C. Elmore, J. Appl. Phys., 19, 55 (1948).

    Article  Google Scholar 

  9. M. Nihei et. al., Jpn. J. Appl. Phys. 42, 721 (2003).

    Article  Google Scholar 

  10. S. Gomi et al., IEEE Custom Integrated Circuits Conf., pp.325, 2004.

  11. M. Swtikes and M. Rothchild, J. Vac. Sci. Technol. B19, 2353 (2001).

    Article  Google Scholar 

  12. T. Eimori, SEMI Forum Japan 2006, pp.6, 2006 (in Japanese)..

  13. Ikeda et al., SEMI STS symposium 2005,pp.9–40, 2005.

  14. Solid State Technol. pp.30, June 2006.

  15. P. Morrow et al., IEEE Electron Device Lett., 27, 335 (2006).

    Article  CAS  Google Scholar 

  16. K. Okamoto, IEICE trans. on electronics, J88-C, 839, 2005 (in Japanese).

    Google Scholar 

  17. J. Andrews and N. Baker; IEEE Micro, 26, 25 (2006).

    Article  Google Scholar 

Download references

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Authors and Affiliations

  1. Osaka University, Osaka, 565-0871, Japan

    Kazuya Okamoto

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  1. Kazuya Okamoto
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Okamoto, K. Current Status of LSI Micro-fabrication and Future Prospect for 3D System Integration. MRS Online Proceedings Library 970, 502 (2006). https://doi.org/10.1557/PROC-0970-Y05-02

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  • DOI: https://doi.org/10.1557/PROC-0970-Y05-02

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