Abstract
Principal challenges to direct fabrication of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. In collaboration with our industrial and academic partners, we have developed viable solutions to address these challenges, as described in this paper.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
G. B. Raupp et al., “Flexible Reflective and Emissive Display Integration and Manufacturing”, SPIE Symp. Proc. 5801, 194–203 (2005).10.1117/12.609033
M. Wu et al., “Complementary Metal-Oxide-Semiconductor Thin-Film Transistors Circuits from a High-Temperature Polycrystalline Silicon Process on Steel Foil Substrates”, IEEE Trans. Elec. Dev. 49, 1993–2000 (2002).
Y. Hong et al., “Stainless Steel Foil Substrates: Robust, Low-cost, Flexible Active-Matrix Backplane Technology”, IMID Digest Paper 28.3, 892–896 (2005).
A. Z. Kattamis et al., “AMOLED Backplanes of Amorphous Silicon on Steel Foils”, Proc. IDRC, pp. 108–111 (2006).
M. J. Powell, “The Physics of Amorphous Silicon Thin-Film Transistors”, IEEE Trans. Elec. Dev. 36 (12), 2753–2763 (1989).10.1109/16.40933
C.-S. Yang et al., “Stability of low-temperature amorphous silicon thin film transistors formed on glass and transparent plastic substrates”, J. Vac. Sci. Technol. B 18 (2), 683–689 (2000).10.1116/1.591259
K. Long et al., “Short channel amorphous silicon TFTs on high temperature clear substrates”, Proc. 62nd Device Res. Conf., pp. 89–90 (2004).
P. Shin, presented at the USDC Flexible Displays and Microelectronics Conference, Phoenix, AZ, 2007 (unpublished).
I.-J. Chung, presented at the Plastic Electronics Conference, Frankfurt, Germany, 2007 (unpublished).
R. A. Street et al., “Comparison of TFT processes on plastic and metal foils”, Proc. 5th Intl. Flexible Displays and Microelectronics Conference, Phoenix, AZ (2006), Paper 4.2.
D. Stryahilev et al., “Amorphous silicon nitride deposited at 120 °C for organic light emitting display-thin film transistor arrays on plastic substrates”, J. Vac. Sci. Technol. 20 (3) 1087–1090 (2002).10.1116/1.1472423
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Shawn, O.R.M., Loy, D.E., Moyer, C. et al. Principal Pilot Line Manufacturing Challenges and Solutions in Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates. MRS Online Proceedings Library 1030, 705 (2007). https://doi.org/10.1557/PROC-1030-G07-05
Received:
Accepted:
Published:
DOI: https://doi.org/10.1557/PROC-1030-G07-05