Skip to main content
SpringerLink
Log in

Adhesion Strength of Cu/Polyimide Measured by Continuous Micro-Wedge Scratch Test

  • Published:
MRS Online Proceedings Library Aims and scope

Abstract

A modified form of nanoscratch test, continuous micro-wedge scratch technique was applied to characterize the adhesion strength of 0.2 μm thick, 10 μm width sputtered copper fine lines on 50 μm thick solid PMDA-ODA polyimide films. A 20 μm width wedge-shaped diamond tip was used to mechanically debond Cu fine lines to polyimide substrate. Using a microindenter under control depth testing mode, critical loads for delaminations were obtained. The scratch morphology and the debonded areas were observed by scanning electron microscopy. The scratch test results by conical-shaped tip on plain films are also presented here and are compared to the results by wedge-shaped tip in fine metal lines. Practical work of adhesion of 4.1 J/m2 was calculated by FEM based on Immaterial fracture mechanism

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P.A. Steinmann and H.E. Hintermann, J. Vac. Sci. Technol., A3, 6, 2394 (1985)

    Google Scholar 

  2. A.J. Perry, Thin Solid films, 107, 167 (1983)

    Article  CAS  Google Scholar 

  3. T.W. Wu, J. Mater. Res., 6, 407 (1991)

    Article  Google Scholar 

  4. S. Venkataraman, D.L. Kolhstedt and W.W. Gerberich, J. Mater. Res., 7, 1126(1992)

    Article  CAS  Google Scholar 

  5. T.W. Wu, R.A. Burn, M.M. Chen, and P.S. Alexopoulos in Micro-Indentation and Micro-scratch Tests on Sub-micron Carbon Films, edited by J.C. Bravman, W.D. Nix, D.M. Barnett and D.A. Smith (Mater. Res. Soc. Proc. 130, Pittsburgh. PA, 1989) pp117–122

  6. J.R. Rice, J. Mater. Res. 6, 407(1991)

    Article  Google Scholar 

  7. P.G. Charalambides, J. Lund, A.G. Evans and R.M. McMeeking, ASME J. Appl. Mech., 56, 77(1989)

    Article  Google Scholar 

  8. Hibbitt, Kaarlson and Sorensen, Inc., ABAQUS User’s Manual V. 5.2 (1992)

Download references

Acknowledgments

Support for this project are provided by Sheldahl Inc., The Center for Interfacial Engineering at University of Minnesota under the grant no. NSF/CDR-872(55), Cardiac Pacemaker, Inc. The authors would like to thank the Minnesota Supercomputer Institute for use of the Cray-X/MP computer.

Author information

Authors and Affiliations

  1. Department of Chemical Engineering and materials Science, University of Minnesota, MPLS, MN, 55455, USA

    F. Wang, J. C. Nelson, H. Huang, M. de Boer & W. W. Gerberich

  2. Sheldahl Inc., Northfield, MN, 55057-0170, USA

    R. L. Swisher

Authors
  1. F. Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. J. C. Nelson
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. H. Huang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. M. de Boer
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. W. W. Gerberich
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. R. L. Swisher
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Wang, F., Nelson, J.C., Huang, H. et al. Adhesion Strength of Cu/Polyimide Measured by Continuous Micro-Wedge Scratch Test. MRS Online Proceedings Library 318, 323–328 (1993). https://doi.org/10.1557/PROC-318-323

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/PROC-318-323

Search

Navigation