Abstract
Comparison of theory and experiment is critical in microelectronic reliability. In this work, a model which has been previously used for electromigration time to failure predictions (developed by Harrison) is extended to include predictions for numbers of voids and void sizes. Predictions from the model are compared to experimental measurements. The model makes reasonable predictions for mean lifetimes, numbers of voids, and void areas with very few free parameters. The model, however, doesnot adequately reproduce therange of lifetimes found in experiment.
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Kime, Y.J. A Macroscopic Model of Electromigration: Comparison with Experiment. MRS Online Proceedings Library 391, 367 (1995). https://doi.org/10.1557/PROC-391-367
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DOI: https://doi.org/10.1557/PROC-391-367