Abstract
Au/Sn solder bumps are mainly used for flip chip assembly of compound semiconductors in optoelectronic and RF applications. They allow a fluxless assembly which is required to avoid contamination of optical interfaces and the metallurgy is well suited to the final gold metallization on GaAs or InP. Flip chip assembly experiments were carried out using two layer Au/Sn bumps as plated without prior bump reflow. An RF and reliability test vehicles comprise a GaAs chip which was flip chip soldered on a silicon substrate. Temperature cycling tests with and without underfiller were performed. The different failure modes for underfilled and nonunderfilled samples were discussed and compared. Additional reliability tests were performed with flip chip bonding by gold thermocompression for comparison. The test results and the failure modes are discussed in detail.
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L. Dietrich, L., Engelmann, G., Ehrmann, O., Reichl, H., Gold and Gold-Tin Wafer Bumping by Electrochemical Deposition for Flip Chip and TAB. 3rd European Conference on Electronic Packaging Technology (EuPac’98), Nuremberg, Germany, June 15–17, 1998.
H. Oppermann, E. Zakel, G. Engelmann, H. Reichl: Investigation of Self-Alignment During Flip-Chip Assembly Using Eutectic Gold-Tin Metallurgy, 4th Int. Conf. and Exhibition on Micro Electro, Opto and Mechanical Systems and Components, MST ‘94.
Ch. Kallmayer, H. Oppermann, J. Kloeser, E. Zakel, H. Reichl, Experimental Results on the Self-Alignment Process Using Au/Sn Metallurgy and on the Growth of the ζ–Phase During the Reflow. Proc. International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, ITAP’95, San Jose, 1995.
M. Hutter, H. Oppermann, G. Engelmann, J. Wolf, O. Ehrmann, R. Aschenbrenner, H. Reichl, Calculation of Shape and Experimental Creation of AuSn Solder Bumps for Flip Chip Applications. Proc 52nd Electronic Components and Technology Conf, San Diego, 2002.
M. Hutter, H. Oppermann, G. Engelmann, J. Wolf, O. Ehrmann, R. Aschenbrenner, H. Reichl: Process Control of the Reflow of AuSn Bumps. Sixth VLSI Packaging Workshop of Japan, November 12–14, 2002, Kyoto Research Park, pp 39–42.
M. Hutter, F. Hohnke, H. Oppermann, M. Klein, G. Engelmann: Assembly and Reliability of Flip Chip Solder Joints Using Miniaturized Au/Sn Bumps. Proc. ECTC 54th 2004, Las Vegas, 1.-4. June 2004, pp 49–57.
F.J. Schmückle, A. Jentzsch, H. Oppermann, K. Riepe, W. Heinrich: W-Band Flip-Chip Interconnects on Thin-Film Substrate. Microwave Symposium Digest, 2002 IEEE MTT-S International, Vol. 3, 2002, pp. 1393–1396.
G. Chmiel, M. Töpper, Ch. Jöhren, A. Achen: Thinfilm Multichip Modules - Process Development Using Photosensitive BCB. Proceedings of the MST Technologies ‘94, Berlin, October 1994.
M. Töpper: Entwicklung einer auf Photo-BCB basierenden Technologie für das Waferlevel Packaging. PhD thesis, Technical University Berlin, 2004, Shaker Verlag, ISBN 3-8322-2557-9.
J. Nave, E. Busse, E. Zakel, H. Reichl: TC Bonding for FC-Technology on Ceramic, Silicon and Organic Substrates. ITAP’96, Sunnyvale,CA, Feb. 1996, pp. 90–98.
A. Bärwolff, J.W. Tomm, R. Müller, S. Weiß, M. Hutter, H. Oppermann, H. Reichl: Spectroscopic Measurement of Mounting-Induced Strain in Optoelectronic Devices. IEEE Transactions on Advanced Packaging, Vol. 23, No. 2, May 2000, pp 170–175.
G. Elger, M. Hutter, H. Oppermann, R. Aschenbrenner, H. Reichl, E. Jäger: Development of an Assembly Process and Reliability Investigations for Flip-Chip LEDs Using the AuSn Soldering. Microsystem Technologies 7 (2002), Springer-Verlag, pp 239–243.
G. Elger, R. Jordan, M. v. Suchodoletz, H. Oppermann: Development of an Low Cost Wafer Level Flip Chip Assembly Process for High Brightness LEDs Using the AuSn Metallurgy. 35th International Symposium on Microelectronics, September 4–6, 2002, Denver, Colorado, pp 199–204.
F.J. Schmückle, F. Lenk, M. Hutter, M. Klein, M. Töpper, K. Riepe, W. Heinrich, H. Oppermann, G. Engelmann: W-band Flip-chip VCO in Thinfilm Environment. to be published at 2005 IEEE MTT-S International Microwave Symposium, Long Beach, CA, June 12–17, 2005.
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Oppermann, H., Hutter, M., Klein, M. et al. Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps. MRS Online Proceedings Library 863, B10.1 (2004). https://doi.org/10.1557/PROC-863-B10.1
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DOI: https://doi.org/10.1557/PROC-863-B10.1