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The effect of additives on the electrodeposition of copper studied by the impedance technique

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Abstract

The impedance technique has been used to study the effects of NaCl, glue, thiourea and ‘Avitone’ on the elctrodeposition of copper in a 0.71M CuSO4-1.80M H2SO4 solution. NaCl affects the rate of the two-step reaction and glue is a polarizer due to adsorption on the surface. The degradation of glue by hydrolysis can be followed using impedance measurements. No significant effects of thiourea and Avitone could be detected in the concentration and potential range used in electrorefining.

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Authors and Affiliations

  1. Department of Chemistry, Helsinki University of Technology, SF-02150, Espoo 15, Finland

    G. Fabricius & G. Sundholm

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  1. G. Fabricius
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  2. G. Sundholm
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Fabricius, G., Sundholm, G. The effect of additives on the electrodeposition of copper studied by the impedance technique. J Appl Electrochem 14, 797–801 (1984). https://doi.org/10.1007/BF00615270

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  • DOI: https://doi.org/10.1007/BF00615270

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