Abstract
The electrodeposition of copper-silver and copper-nickel powders from aqueous ammoniacal solutions at a continuously scraped rotating cylinder cathode is described. Ag-Cu powders can be prepared under these conditions, but the individual particles are inhomogeneous and the extent of this inhomogeneity is examined. Surface areas (from BET) and particle size distributions are reported, and the morphology is considered. Cu-Ni powders deposited under these conditions are heavily contaminated with oxide/ hydroxides and this is attributed to an increase in near-cathode pH.
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Kuhn, A.T., Neufeld, P. & Young, K. The electrodeposition of copper-silver and copper-nickel alloy powders from aqueous ammoniacal solutions. J Appl Electrochem 14, 605–613 (1984). https://doi.org/10.1007/BF00626304
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DOI: https://doi.org/10.1007/BF00626304