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Heat transfer mechanism of miniature loop heat pipe with water-copper nanofluid: thermodynamics model and experimental study

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Abstract

In order to ensure the normal work of electronic product, the thermal management is of key importance. Miniature loop heat pipe (mLHP) is a promising device of heat transfer for electronic products. Cu-water nanofluid with different concentration is used as working material in mLHP. Experiments are conducted to investigate its heat transfer performance. The heat flux owing to thermal diffusion is calculated. It is found that this heat flux and the boiling temperature are non-monotonic function of concentration of nanoparticle. Turning concentration appears at about 1.5 wt%. Differential equation of thermal diffusion produced by micro movement of nanoparticle is established in this paper. Average speed formula for nanoparticles is derived and slope of the curve of phase equilibrium is obtained. Based on the theoretical research in this paper, enhanced heat transfer mechanism of nanofluid is analyzed. The facts that heat flux owing to thermal diffusion and boiling temperature are all associated with nanoparticle concentration are also well explained with the aid of the derived theory in this paper.

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Abbreviations

\(c_{p}\) :

Specific capacity

\(F(\tau )\) :

Brownian force

\(k_{f}\) :

Thermal conductivity corresponding to single-phased base liquid

\(k_{d}\) :

Thermal conductivity corresponding to heat diffusion

\(\Updelta H\) :

Enthalpy increase of nanoparticle

\(\Updelta_{vap} H_{m}\) :

Evaporation enthalpy of solvent

\(m\) :

Mass of nanoparticle

\(\dot{m}\) :

Mass of evaporated base liquid per unit volume owing to heat diffusion

\(n\) :

Number of nanoparticle per unit volume

\(P_{A}\) :

Vapor pressure of solvent in weak solution

\(q_{1}\) :

Heat flux corresponding to single-phased base liquid

\(q_{2}\) :

Heat flux corresponding to heat diffusion

\(r\) :

Radius of bubble

\(R\) :

Gas constant

\(S\) :

Area of heating board

\(T\) :

Temperature

\(T_{w}\) :

Temperature of wall

\(T_{b}\) :

Boiling temperature

\(u\) :

Speed of nanoparticle

\(\bar{u}\) :

Average speed of nanoparticle

\(V\) :

Volume

\(x_{A}\) :

Molar concentration of solvent

\(x_{B}\) :

Molar concentration of solute

\(\tau\) :

Time

\(\rho\) :

Density

\(\mu\) :

Viscosity coefficient

\(\sigma\) :

Surface tension coefficient of nanofluid

‘:

Nanoparticle

*:

Pure solvent

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Acknowledgments

This work is supported by the Fund of the National Natural Science Foundation of China (Grant No. 21106048).

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Authors and Affiliations

  1. Department of physics, School of Science, South China University of Technology, Guangzhou, 510640, China

    Xiao-wu Wang

  2. Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes, South China University of Technology, Guangzhou, 510640, China

    Zhen-ping Wan & Yong Tang

Authors
  1. Xiao-wu Wang
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  2. Zhen-ping Wan
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Correspondence to Xiao-wu Wang.

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Wang, Xw., Wan, Zp. & Tang, Y. Heat transfer mechanism of miniature loop heat pipe with water-copper nanofluid: thermodynamics model and experimental study. Heat Mass Transfer 49, 1001–1007 (2013). https://doi.org/10.1007/s00231-013-1144-9

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  • DOI: https://doi.org/10.1007/s00231-013-1144-9

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