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The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

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Abstract

Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.

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Acknowledgments

We would like to thank the EPSRC and AML for their support and partnership in this work undertaken as part of a CASE funded studentship.

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Authors and Affiliations

  1. The Open University, Milton Keynes, MK7 6AA, UK

    V. Masteika, J. Kowal & N. St. J. Braitwaite

  2. Applied Microengineering Limited, Unit 8, Library Avenue Harwell Campus, Didcot, Oxfordshire, OX11 0SG, UK

    T. Rogers

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  1. V. Masteika
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  2. J. Kowal
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  3. N. St. J. Braitwaite
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  4. T. Rogers
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Correspondence to V. Masteika.

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Masteika, V., Kowal, J., Braitwaite, N.S.J. et al. The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers. Microsyst Technol 19, 705–712 (2013). https://doi.org/10.1007/s00542-012-1685-8

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  • DOI: https://doi.org/10.1007/s00542-012-1685-8

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