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Effect of substrate on electroplated copper sulphide thin films

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Abstract

Copper Sulphide thin films have been prepared on different substrates using electrodeposition technique. X-ray diffraction analysis showed that the prepared films possess polycrystalline in nature with cubic structure. Microstructural parameters such as crystallite size, strain and dislocation density are determined using X-ray diffraction data. Film composition and surface morphology have been analyzed using Scanning electron microscopy and Energy dispersive analysis by X-rays. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.2 and 2.4 eV for films obtained on different substrates.

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Acknowledgments

The corresponding author Dr. S. Thanikaikarasan (Principal Investigator) and B. Bharathi (Junior Research Fellow) gratefully acknowledge the financial support received from the Board of Research in Nuclear Sciences, Department of Atomic Energy (BRNS-DAE), Mumbai, India with File No. 2012/34/13/BRNS/No. 166 for carrying out this research work.

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Authors and Affiliations

  1. Centre for Scientific and Applied Research, School of Basic Engineering and Sciences, PSN College of Engineering and Technology, Tirunelveli, 627 152, Tamil Nadu, India

    B. Bharathi, S. Thanikaikarasan, P. V. Chandrasekar & X. Sahaya Shajan

  2. Department of Metallurgical Engineering and Materials Science, DST-INSPIRE Faculty, Indian Institute of Technology, Mumbai, 400 076, Maharashtra, India

    Pratap Kollu

  3. Institute of Optoelectronic Display, Fuzhou University, Fuzhou, 350 002, Republic of China

    P. V. Chandrasekar

  4. School of Physics, Alagappa University, Karaikudi, 630 004, Tamil Nadu, India

    K. Sankaranarayanan

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  1. B. Bharathi
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  5. K. Sankaranarayanan
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  6. X. Sahaya Shajan
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Correspondence to S. Thanikaikarasan.

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Bharathi, B., Thanikaikarasan, S., Kollu, P. et al. Effect of substrate on electroplated copper sulphide thin films. J Mater Sci: Mater Electron 25, 5338–5344 (2014). https://doi.org/10.1007/s10854-014-2310-7

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  • DOI: https://doi.org/10.1007/s10854-014-2310-7

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