Abstract
We investigated the thermal performance of micro-hole cellular structure using Al2O3–H2O and CuO–H2O nanofluids with 0.67% and 0.4%, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345 W. We found that the thermal conductivities of Al2O3–H2O and CuO–H2O nanofluids were enhanced by 2% and 1.19%, respectively, as compared to the base fluid (water). Using Al2O3–H2O nanofluids, we achieved the minimum base temperature of 24.5 °C and 26.6 °C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO–H2O nanofluids, we achieved the minimum base temperature of 25.5 °C and 27.7 °C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8% and 8.5% for Al2O3–H2O and CuO–H2O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 °C and 27.7 °C using Al2O3–H2O and CuO–H2O nanofluids, respectively, which was about 17.6% and 14.5% lower than the reported temperature value of 32.3 °C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T).
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Abbreviations
- A b :
-
Frontal blocked area (mm2)
- A t :
-
Frontal total area (mm2)
- A s :
-
Surface area (mm2)
- b :
-
Length of square side (mm)
- c :
-
Centre to centre distance (mm)
- C nf :
-
Specific heat of nanofluids (kJ kg−1 K−1)
- C np :
-
Specific heat of nanoparticles (kJ kg−1 K−1)
- C bf :
-
Specific heat of base fluid (kJ kg−1 K−1)
- d h :
-
Hole diameter (mm)
- H :
-
Height (mm)
- K cell :
-
Pressure loss coefficient
- \( K_{\text{nf}} \) :
-
Thermal conductivity of nanofluids (W mK−1)
- \( K_{\text{np}} \) :
-
Thermal conductivity of nanoparticles (W mK−1)
- \( K_{\text{bf}} \) :
-
Thermal conductivity of base fluid (W mK−1)
- L :
-
Length (mm)
- LMTD:
-
Log of mean temperature difference (°C)
- LPM:
-
Litres per minute
- \( \dot{m} \) :
-
Mass flow rate (kg s−1)
- ΔP :
-
Pressure difference (Pa)
- \( \dot{Q} \) :
-
Heat transfer rate (W)
- \( \dot{Q} \) :
-
Volumetric flow rate (LPM)
- R BR :
-
Blockage ratio
- R OPEN :
-
Open area ratio
- R th :
-
Thermal resistance (°C/W)
- T b :
-
Base temperature (°C)
- T i :
-
Fluid inlet temperature (°C)
- T o :
-
Fluid outlet temperature (°C)
- t :
-
Wall thickness (mm)
- V :
-
Volume of the structure (mm3)
- V b :
-
Total volume of whole solid block (mm3)
- W :
-
Width (mm)
- w np :
-
Weight fraction of nanoparticles
- w bf :
-
Weight fraction of base fluid
- α sf :
-
Surface area density
- ε :
-
Porosity
- ρ bf :
-
Density of base fluid (kg m−3)
- ρ np :
-
Density of nanoparticles (kg m−3)
- ρ nf :
-
Density of nanofluids (kg m−3)
- µnf :
-
Dynamic viscosity of nanofluids (kg ms−1)
- µbf :
-
Dynamic viscosity of base fluid (kg ms−1)
- \( \emptyset \) :
-
Volume fraction
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Tariq, H.A., Shoukat, A.A., Hassan, M. et al. Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids. J Therm Anal Calorim 136, 2171–2182 (2019). https://doi.org/10.1007/s10973-018-7852-0
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DOI: https://doi.org/10.1007/s10973-018-7852-0