Abstract
This paper presents the implementation of a wireless multimedia DSP chip for mobile applications. The implemented DSP chip supports communication instructions for Viterbi, timing synchronization, etc. as well as multimedia instructions. The DSP can handle variable length data and perform four MACs in a cycle. The proposed DSP employs parallel processing techniques, such as SIMD, vector processing, DSP schemes and adopts low power features for wireless applications. The implemented DSP chip includes test circuits and various peripherals, such as DMA, bus arbitration, timer, etc. This chip has been modeled by Verilog HDL and implemented using the 0.35 μm HCB60 library. The total gate count excluding memory is about 170,000 gates and the clock frequency is 100 MHz.
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Junghoo Lee received the B.S. degree in electronic engineering from Ajou University, Suwon, Korea in 2002. He is currently working toward the Ph.D. degree with School of Electrical and Computer Engineering, Ajou University. His main research interests include SOC design and application-specific DSP chip design.
Myung H. Sunwoo received the B.S. degree in electronic engineering from the Sogang University in 1980, the M.S. degree in electrical and electronics from the Korea Advanced Institute of Science and Technology in 1982, and the Ph.D. degree in electrical and computer engineering from the University of Texas at Austin in 1990.
He worked for Electronics and Telecommunications Research Institute (ETRI) in Daejeon, Korea from 1982 to 1985 and Digital Signal Processor Operations, Motorola, Austin, TX from 1990 to 1992. Since 1992, he has been a Professor with the School of Electrical and Computer Engineering, Ajou University in Suwon, Korea. In 2000, he was a Visiting Professor in the Department of Electrical and Computer Engineering, the University of California, Davis, CA. He is the Director of the National Research Laboratory sponsored by the Ministry of Science and Technology. His research interests include VLSI architectures, SOC design for multimedia and communications, and application-specific DSP architectures.
Dr. Sunwoo has published more than 120 papers in international transactions/journals and conferences and also has 28 patents including five U.S. patents. He served as a Technical Program Chair of the IEEE Workshop on Signal Processing Systems (SIPS) in 2003 and a member of the technical program committee of various international conferences. He has received a number of research awards from the Ministry of Commerce, Industry and Energy, Samsung Electronics, and professional foundations. He served as an Associate Editor for the IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2002–2003) and as a Guest Editor for the Journal of VLSI Signal Processing (Kluwer, 2004). Currently, He is a Senior Member of IEEE and a Chair of the IEEE CAS Society of the Seoul Chapter.
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Lee, J.L., Sunwoo, M.H. Implementation of a Wireless Multimedia DSP Chip for Mobile Applications. J VLSI Sign Process Syst Sign Image Video Technol 40, 281–287 (2005). https://doi.org/10.1007/s11265-005-5264-4
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DOI: https://doi.org/10.1007/s11265-005-5264-4