The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.
References
C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).
K. Suganuma, Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).
K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).
S.K. Kang and A.K. Sarkhel, J. Electron. Mater. 23, 701 (1994).
D. Napp, Sampe J. 32, 59 (1996).
A.Z. Miric and A. Grusd, Soldering Surface Mount Technol. 10, 19 (1998).
S. Heart, Clean 36, 145 (2008).
M.E. Loomans and M.E. Fine, Metall. Mater. Trans. A 31, 1155 (2000).
I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, R. Kainuma, and K. Ishida, J. Electron. Mater. 29, 1137 (2000).
K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).
M. Palcut, J. Sopoušek, L. Trnková, E. Hodulová, B. Szewczyková, M. Ožvold, M. Turňa, and J. Janovec, Kovove Mater. 47, 43 (2009).
X.J. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, and J. Pstrus, J. Electron. Mater. 31, 1139 (2002).
B. Sundman, B. Jansson, and J.-O. Andersson, Calphad 9, 153 (1985).
J.-O. Andersson, T. Helander, L.H. Hoglund, P.F. Shi, and B. Sundman, Calphad 26, 273 (2002).
A. Kroupa, A.T. Dinsdale, A. Watson, J. Vrestal, J. Vizdal, and A. Zemanova, JOM 59, 20 (2007).
http://gttserv.lth.rwth-aachen.de/~cg/Consulting/Workshops/WS2008/Dinsdale_2008.pdf (6.83 MB, accessed 14 Sept 2009).
A.T. Dinsdale, A. Watson, A. Kroupa, J. Vr̆ešt'ál, A. Zemanová, and J. Vízdal, COST Action 531—Atlas of Lead-free Soldering. COST Office 2008, ISBN 978-80-86292-28-1.
H.-T. Lee, C.-Y. Lee, F.-K. Lee, Y.-F. Chen, and Y.-H. Lee, J. Electron. Mater. 38, 2112 (2009).
T. Heumann and O. Alpaut, J. Less-Common Metals 6, 108 (1964).
S.F. Bartram, W.G. Moffatt, and B.W. Roberts, J. Less-Common Metals 62, 9 (1978).
T.-M. Korhonen and J.K. Kivilahti, J. Electron. Mater. 27, 149 (1998).
Z. Moser, W. Gasior, J. Pstrus, W. Zakulski, I. Ohnuma, X.J. Liu, Y. Inohana, and K. Ishida, J. Electron. Mater. 30, 1120 (2001).
P.-Y. Chevalier, Thermochim. Acta 136, 45 (1988).
A. Bolcavage, S.W. Chen, C.R. Kao, Y.A. Chang, and A.D. Roming, J. Phase Equilib. Diffusion 14, 14 (1993).
C.R. Kao, A. Bolccwage, S.-L. Chen, S.W. Chen, Y.A. Chang, and A.D. Roming, J. Phase Equilib. Diffusion 14, 22 (1993).
J.H. Shim, C.S. Oh, B.J. Lee, and D.N. Lee, Z. Metallkunde 87, 205 (1996).
H.S. Liu, X.J. Liu, Y. Cui, C.P. Wang, I. Ohnuma, R. Kainuma, Z.P. Jin, and K. Ishida, J. Phase Equilib. Diffusion 23, 409 (2002).
X.J. Liu, C.P. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, Metall. Mater. Trans. A 35, 1641 (2004).
X.J. Liu, H.S. Liu, I. Ohnuma, R. Kainuma, K. Ishida, S. Itabashi, K. Kameda, and K. Yamaguchi, J. Electron. Mater. 30, 1093 (2001).
L. Snugovsky, P. Snugovsky, D.D. Perovic, and J.W. Rutter, Mater. Sci. Technol. 23, 432 (2007).
W.J. Boettinger, U.R. Kattner, K.-W. Moon, and J.-H. Perepezko, DTA and Heat-flux DSC Measurements of Alloy Melting and Freezing (Washington: National Institute of Standards and Technology, 2006).
Acknowledgements
The authors are grateful to Dr. Aleš Kroupa from the Institute of Physics of Materials, Czech Academy of Sciences Brno for his assistance with the EDX measurements. One of the authors (M.P.) would like to thank Dr. Ruth Knibbe from the Division of Fuel Cells and Solid State Chemistry, Risø National Laboratory (Roskilde, Denmark) for her careful proof-reading of the text. Project support through Grants VEGA 1/3032/06, VEGA 1/3191/06, MSM0021622410, and COST MP0602/08 is also fully acknowledged.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Sopoušek, J., Palcut, M., Hodúlová, E. et al. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. J. Electron. Mater. 39, 312–317 (2010). https://doi.org/10.1007/s11664-009-1070-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-009-1070-2