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Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging

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Abstract

The thermal, mechanical, and dielectric properties of new high-performance polyphenylene sulfide/aluminum nitride (AlN) composites prepared by hot pressing were investigated for use in electronic packaging. The coefficient of thermal expansion was decreased by 41%. The glass-transition temperature and Vickers microhardness were increased by 13°C and 46%, respectively, for the 15.1 vol.% AlN composite. A modified rule of mixtures with β of 0.065 fits the data. The dielectric constant and loss factor of the composites are within the range of requirements for commercial use.

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Authors and Affiliations

  1. Department of Metallurgy and Materials Science, College of Engineering, Pune, Shivajinagar, Pune, 411 005, India

    R. K. Goyal & P. Jadhav

  2. Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai, 400 076, India

    A. N. Tiwari

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  1. R. K. Goyal
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  2. P. Jadhav
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  3. A. N. Tiwari
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Correspondence to R. K. Goyal.

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Goyal, R.K., Jadhav, P. & Tiwari, A.N. Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging. J. Electron. Mater. 40, 1377–1383 (2011). https://doi.org/10.1007/s11664-011-1520-5

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  • DOI: https://doi.org/10.1007/s11664-011-1520-5

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