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Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

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Silver nanoparticle (NP) paste was fabricated and used to bond copper wire to copper foil at low temperatures down to 160°C. The silver NP paste was developed by increasing the concentration of 50 nm silver NP sol from 0.001 vol.% to 0.1 vol.% by centrifugation. The 0.001 vol.% silver NP sol was fabricated in water by reducing silver nitrate (AgNO3) using sodium citrate dihydrate (Na3C6H5O7·2H2O). The bond was formed by solid-state sintering among the individual silver NPs and solid-state bonding of these silver NPs onto both copper wire and foil. Metallurgical bonds between silver NPs and copper were confirmed by transmission electron microscopy (TEM). The silver NPs were coated with an organic shell to prevent sintering at room temperature (RT). It was found that the organic shell decomposed at 160°C, the lowest temperature at which a bond could be formed. Shear tests showed that the joint strength increased as the bonding temperature increased, due to enhanced sintering of silver NPs at higher temperatures. Unlike low-temperature soldering techniques, bonds formed by our method have been proved to withstand temperatures above the bonding temperature.

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References

  1. Y. Zhou, eds., Microjoining and Nanojoining (Cambridge, UK: CRC/Woodhead, 2008).

    Google Scholar 

  2. Y. Zhou, A. Hu, M.I. Khan, W. Wu, B. Tam, and M. Yavuz, J. Phys. Conf. Ser. 165, 012021 (2009).

    Article  Google Scholar 

  3. H. Tatsumi, Y. Akada, T. Yamaguchi, and A. Hirose, Adv. Mater. Res. 26–28, 499 (2007).

    Article  Google Scholar 

  4. T. Morita, Y. Yasuda, E. Ide, Y. Akada, and A. Hirose, Mater. Trans. 49, 2875 (2008).

    Article  CAS  Google Scholar 

  5. Z.Z. Fang and H. Wang, Int. Mater. Rev. 53, 326 (2008).

    Article  CAS  Google Scholar 

  6. K. Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, and C.P. Wong, J. Electron. Mater. 34, 168 (2005).

    Article  CAS  Google Scholar 

  7. M. Yeadon, J. Yang, R. Averback, J. Bullard, and J. Gibson, Nanostruct. Mater. 10, 731 (1998).

    Article  CAS  Google Scholar 

  8. K.K. Nanda, A. Maisels, F.E. Kruis, H. Fissan, and S. Stappert, Phys. Rev. Lett. 91, 106102 (2003).

    Article  CAS  Google Scholar 

  9. Q. Jiang, S.H. Zhang, and J.C. Li, Solid State Commun. 130, 581 (2004).

    Article  CAS  Google Scholar 

  10. R. German, Sintering Theory and Practice (New York, John Wiley & Sons, Inc, 1996), p. 70.

  11. E. Ide, A. Angata, A. Hirose, and K.F. Kobayashi, Acta Mater. 53, 2385 (2005).

    Article  CAS  Google Scholar 

  12. Y. Akeda, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita, and E. Ide, Mater. Trans. 49, 1537 (2008).

    Article  Google Scholar 

  13. T. Morita, E. Ide, Y. Yasuda, A. Hirose, and K. Kobayashi, Jpn. J. Appl. Phys. 47, 6615 (2008).

    Article  CAS  Google Scholar 

  14. E. Ide, S. Angata, A. Hirose, and K.F. Kobayashi, Mater. Sci. Forum 512, 383 (2006).

    Article  CAS  Google Scholar 

  15. D. Wakuda, M. Hatamura, and K. Suganuma, Chem. Phys. Lett. 441, 305 (2007).

    Article  CAS  Google Scholar 

  16. D. Wakuda, K. Kim, and K. Suganuma, IEEE Trans. Compon. Packag. Technol. 32, 627 (2009).

    Article  CAS  Google Scholar 

  17. A. Hu, J.Y. Guo, H. Alarifi, G. Patane, Y. Zhou, G. Compagnini, and C.X. Xu, Appl. Phys. Lett. 97, 153117 (2010).

    Article  Google Scholar 

  18. D.V. Goia and E. Matijević, N. J. Chem. 22, 1203 (1998).

    Article  CAS  Google Scholar 

  19. P.C. Lee and D. Meisel, J. Phys. Chem. 86, 3391 (1982).

    Article  CAS  Google Scholar 

  20. Y. Badr, M.G. Abd El Wahed, and M.A. Mahmoud, Appl. Surf. Sci. 253, 2502 (2006).

    Article  CAS  Google Scholar 

  21. Y. Tan, Y. Li, and D. Zhu, J. Colloid Interf. Sci. 258, 244 (2003).

    Article  CAS  Google Scholar 

  22. R. Deegan, Phys. Rev. E 61, 475 (2000).

    Article  CAS  Google Scholar 

  23. H. Tada, J. Bronkema, and A.T. Bell, Catal. Lett. 92, 93 (2004).

    Article  CAS  Google Scholar 

  24. E.L. Force and A.T. Bell, J. Catal. 38, 440 (1975).

    Article  CAS  Google Scholar 

  25. L. Ding, R. Davidchack, and J. Pan, Comput. Mater. Sci. 45, 247 (2009).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Department of Mechanical and Mechatronics Engineering, Centre for Advanced Materials Joining, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada

    Hani Alarifi, Anming Hu, Mustafa Yavuz & Y. Norman Zhou

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  1. Hani Alarifi
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  2. Anming Hu
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  3. Mustafa Yavuz
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  4. Y. Norman Zhou
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Correspondence to Hani Alarifi or Anming Hu.

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Alarifi, H., Hu, A., Yavuz, M. et al. Silver Nanoparticle Paste for Low-Temperature Bonding of Copper. J. Electron. Mater. 40, 1394–1402 (2011). https://doi.org/10.1007/s11664-011-1594-0

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  • DOI: https://doi.org/10.1007/s11664-011-1594-0

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