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The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

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Abstract

The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high-G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

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Authors and Affiliations

  1. Component Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, 95134, USA

    Tae-Kyu Lee

  2. Michigan State University, East Lansing, MI, USA

    Bite Zhou & Thomas R. Bieler

  3. National Tsing Hua University, Hsinchu, Taiwan

    Chien-Fu Tseng & Jeng-Gong Duh

Authors
  1. Tae-Kyu Lee
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  2. Bite Zhou
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  3. Thomas R. Bieler
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  4. Chien-Fu Tseng
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  5. Jeng-Gong Duh
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Correspondence to Tae-Kyu Lee.

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Lee, TK., Zhou, B., Bieler, T.R. et al. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance. J. Electron. Mater. 42, 215–223 (2013). https://doi.org/10.1007/s11664-012-2340-y

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  • DOI: https://doi.org/10.1007/s11664-012-2340-y

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