Abstract
Mathematical modeling of infiltration dynamics of liquid Cu-Si alloy into porous carbon is presented. Two-dimensional infiltration equations are developed using the Washburn equation in the limit of both interface and diffusion control, for situations where the capillary radius decreases either linear or parabolic, and the contact angles are assumed to exponentially decrease with time during infiltration. One major manufacturing process for the Cu-Si/C composites is liquid melt infiltration. This article focuses on nonequilibrium wetting effects and offers a fundamental approach to these complex kinetic phenomena.
Similar content being viewed by others
References
G.L. Jian and H. Hausner, J. Am. Ceram. Soc. 79, 873 (1996).
Y. Liu, C. Zhang, S. Qiao, and Z. Yang, Adv. Eng. Mater. 12 (2010).
N. Eustathopoulos, Acta Mater. 46, 2319 (1998).
O. Dezellus, F. Hodaj, and N. Eustathopoulos, J. Eur. Ceram. Soc. 23, 2797 (2003).
F.H. Gern, Compos. Part A 28A, 355 (1997).
R. Asthana, J. Colloid Interface Sci. 231, 398 (2000).
S. Kumar, A. Kumar, R. Devi, A. Shukla, and A.K. Gupta, J. Eur. Ceram. Soc. 29, 2651 (2009).
R. Asthana, Scr. Mater. 38, 1203 (1998).
E. Fitzer, Pure Appl. Chem. 60, 287 (1988).
V. Michaud and A. Mortensen, Compos. Part A 32, 981 (2001).
K. Iqbal, J. Sha, and A. Maqsood, Proceedings of the 2013 International Symposium on Liquid Metal Processing and Casting, (New York, NY: Wiley, 2013).
K. Nogi, Y. Hirata, T. Matsumoto, and H. Fujii, J. Phys. 165, 012073 (2009).
R. Messner and Y.M. Chiang, J. Am. Ceram. Soc. 73, 1193 (1990).
I. Egry, Scr. Metall. Mater. 28, 1273 (1993).
R. Asthana, Metall. Mater. Trans. A 33A, 2122 (2002).
M. Adachi, M. Schick, J. Brillo, I. Egry, and M. Watanabe, J. Mater. Sci. 45, 2004 (2010).
I. Egry, G. Lohofer, and S. Sauerland, J. Non-Cryst. Solids 156, 830 (1993).
Acknowledgements
K. Iqbal is grateful to the China Scholarship Council (CSC) for funding Ph.D. scholarships.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Iqbal, K., Sha, J.J., Lei, ZK. et al. Numerical Studies of Infiltration Dynamics of Liquid–Copper and Silicon/Solid–Carbon System. JOM 66, 953–959 (2014). https://doi.org/10.1007/s11837-014-0951-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11837-014-0951-x