Microstructure and properties of Cu–Ti–Ni alloys

Abstract

The effects of Ni addition and aging treatments on the microstructure and properties of a Cu–3Ti alloy were investigated. The microstructure and precipitation phases were characterized by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy; the hardness, electrical conductivity, and elastic modulus of the resulting alloys were also tested. The results show that Ni addition increases the electrical conductivity and elastic modulus, but decreases the hardness of the aged Cu–3Ti alloy. Within the range of the experimentally investigated parameters, the optimal two-stage aging treatment for the Cu–3Ti–1Ni and Cu–3Ti–5Ni alloy was 300°C for 2 h and 450°C for 7 h. The hardness, electrical conductivity, and elastic modulus of the Cu–3Ti–1Ni alloy were HV 205, 18.2% IACS, and 146 GPa, respectively, whereas the hardness, electrical conductivity, and elastic modulus of the Cu–3Ti–5Ni alloy were HV 187, 31.32% IACS, and 147 GPa, respectively. Microstructural analyses revealed that β′-Ni3Ti and β′-Cu4Ti precipitate from the Cu matrix during aging of the Cu–3Ti–5Ni alloy and that some residual NiTi phase remains. The increased electrical conductivity is ascribed to the formation of NiTi, β′-Ni₃Ti, and β′-Cu₄Ti phases.