Overview
- Discusses lead-free solder materials industry their selection and how they are currently used industry wide
- Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture assessments
- Presents materials testing and characterization at the macro, micro, and nano scale
- Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact
- Includes supplementary material: sn.pub/extras
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Table of contents (9 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Authors and Affiliations
Bibliographic Information
Book Title: Lead Free Solder
Book Subtitle: Mechanics and Reliability
Authors: John Hock Lye Pang
DOI: https://doi.org/10.1007/978-1-4614-0463-7
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2012
Hardcover ISBN: 978-1-4614-0462-0
Softcover ISBN: 978-1-4899-9116-4
eBook ISBN: 978-1-4614-0463-7
Edition Number: 1
Number of Pages: X, 175
Number of Illustrations: 162 b/w illustrations
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Solid Mechanics, Circuits and Systems