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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

  • Book
  • © 1999

Overview

Part of the book series: Microsystems (MICT, volume 6)

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Table of contents (6 chapters)

Keywords

Authors and Affiliations

  • Stanford University, USA

    Y. Sungtaek Ju, Kenneth E. Goodson

Bibliographic Information

  • Book Title: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

  • Authors: Y. Sungtaek Ju, Kenneth E. Goodson

  • Series Title: Microsystems

  • DOI: https://doi.org/10.1007/978-1-4615-5211-6

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1999

  • Hardcover ISBN: 978-0-7923-8591-2Published: 31 August 1999

  • Softcover ISBN: 978-1-4613-7374-2Published: 02 November 2012

  • eBook ISBN: 978-1-4615-5211-6Published: 06 December 2012

  • Series ISSN: 1389-2134

  • Edition Number: 1

  • Number of Pages: XXI, 102

  • Topics: Electrical Engineering, Optical and Electronic Materials, Classical Mechanics

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