Overview
- Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
- Covers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic packaging
- Contains a balanced number of chapter authors from academia and industry, who are leaders in their respective fields
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents (22 chapters)
Keywords
About this book
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
Editors and Affiliations
About the editors
Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.
Bibliographic Information
Book Title: Materials for Advanced Packaging
Editors: Daniel Lu, C.P. Wong
DOI: https://doi.org/10.1007/978-3-319-45098-8
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2017
Hardcover ISBN: 978-3-319-45097-1Published: 30 December 2016
Softcover ISBN: 978-3-319-83209-8Published: 08 June 2018
eBook ISBN: 978-3-319-45098-8Published: 18 November 2016
Edition Number: 2
Number of Pages: XVI, 969
Number of Illustrations: 260 b/w illustrations, 440 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Nanotechnology and Microengineering, Metallic Materials, Optical and Electronic Materials, Circuits and Systems