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Reactive Sputter Deposition

  • Book
  • © 2008

Overview

Editors:
  1. Diederik Depla

    1. Department of Solid-State Sciences, Gent University, Belgium

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    You can also search for this editor in PubMed   Google Scholar

  2. Stijn Mahieu

    1. Department of Solid-State Sciences, Gent University, Belgium

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    You can also search for this editor in PubMed   Google Scholar

  • Covers all the sputtering techniques for thin-film deposition
  • Describes the physical basics and related technical realization
  • Gives advice on controlling the sputter process and quality of the layers produced
  • Valuable reference work for researchers as well as study text for graduate students
  • Includes supplementary material: sn.pub/extras

Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 109)

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Table of contents (14 chapters)

  1. Front Matter

    Pages i-xviii
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  2. Simulation of the Sputtering Process

    • Tadayoshi Ono, Takahiro Kenmotsu, Tetsuya Muramoto
    Pages 1-42

  3. Electron Emission from Surfaces Induced by Slow Ions and Atoms

    • R. A. Baragiola, Pierfrancesco Riccardi
    Pages 43-60

  4. Modeling of the Magnetron Discharge

    • Annemie Bogaerts, Ivan Kolev, Guy Buyle
    Pages 61-130

  5. Modelling of Reactive Sputtering Processes

    • Sören Berg, Tomas Nyberg, Tomas Kubart
    Pages 131-152

  6. Depositing Aluminium Oxide: A Case Study of Reactive Magnetron Sputtering

    • Diederik Depla, Stijn Mahieu, Roger De Gryse
    Pages 153-197

  7. Transport of Sputtered Particles Through the Gas Phase

    • Stijn Mahieu, Koen Van Aeken, Diederik Depla
    Pages 199-227

  8. Energy Deposition at the Substrate in a Magnetron Sputtering System

    • Samuel D. Ekpe, Steven K. Dew
    Pages 229-254

  9. Process Diagnostics

    • James W. Bradley, Thomas Welzel
    Pages 255-300

  10. Optical Plasma Diagnostics During Reactive Magnetron Sputtering

    • Stephanos Konstantinidis, F. Gaboriau, M. Gaillard, M. Hecq, A. Ricard
    Pages 301-335

  11. Reactive Magnetron Sputtering of Indium Tin Oxide Thin Films: The Cross-Corner and Cross-Magnetron Effect

    • H. Kupfer, F. Richter
    Pages 337-366

  12. Reactively Sputter-Deposited Solid Electrolytes and Their Applications

    • Pascal Briois, Frédéric Lapostolle, Alain Billard
    Pages 367-411

  13. Reactive SputteredWide-Bandgap p-Type Semiconducting Spinel AB2O4 and Delafossite ABO2 Thin Films for “Transparent Electronics”

    • Arghya N. Banerjee, Kalyan K. Chattopadhyay
    Pages 413-484

  14. Oxide-Based Electrochromic Materials and Devices Prepared by Magnetron Sputtering

    • C. G. Granqvist
    Pages 485-495

  15. Atomic Assembly of Magnetoresistive Multilayers

    • Haydn Wadley, Xiaowang Zhou, William H. Butler
    Pages 497-559

  16. Back Matter

    Pages 561-570
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Keywords

About this book

The most straightforwardmethod to change the surface properties of a ma- rial is to deposit a thin ?lm or coating on it. Hence, it is not surprising that an overwhelming amount of scienti?c and technical papers is published each year on this topic. Sputter deposition is one of the many so-called physical vapour deposition (PVD) techniques. In most cases, sputter deposition uses a magnetically enhanced glow discharge or magnetron discharge to produce the ions which bombard and sputter the cathode material. In the ?rst chapter of this book (Chap. 1), the details of the sputter process are discussed. Essential to sustain the discharge is the electron emission during ion bombardment. Indeed, the emitted electrons are accelerated from the target and can ionize gas atoms. The formed ions bombard again the target completing the s- taining process. A complete chapter is assigned to this process to highlight its importance (Chap. 2). Although the sustaining process can be described quite straightforward, a complete understanding of the magnetron discharge and the in?uence of di?erent parameters on the discharge characteristics is onlypossiblebymodelling(seeChap.3).Withthesethreechapters,thereader should be able to form an idea of the target and plasma processes occurring during a DC magnetron discharge.

Editors and Affiliations

  • Department of Solid-State Sciences, Gent University, Belgium

    Diederik Depla, Stijn Mahieu

About the editors

Prof. Dr. D. Depla has received his Master Degree in Chemistry in 1991 at Ghent University (Belgium). In 1996 he promoted with a PhD thesis on Solid State Chemistry. After a short period as senior scientist in the Department for Solid State Sciences, he became in 1999 Professor at the Department for Solid State Sciences where his research focussed on the fundamental aspects of reactive magnetron sputtering. He has shown the importance of ion implantation in the description of the reactive magnetron sputter process. In this way, his continuous research in this area resulted in several publications.

Dr. S. Mahieu received his Master Degree in Physics in 2002 and promoted in 2006 with the PhD thesis entitled "Biaxial alignment in sputter deposited thin films" in the department of Solid State Sciences, Ghent University (Belgium). During his PhD, he focussed on the modelling of thin film growth, plasma characterization and the simulation of transport of sputtered particles, resulting in the elaboration of a new structure zone model as published in an invited review in Thin Solid Films. As Postdoctoral Fellow of the Research Foundation - Flanders (FWO), his current research is focussed on characterizing and modelling the relation between thin film growth and the energy flux towards the substrate during magnetron sputtering.

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