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Thermal Management of Electronic Systems II

Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

  • Conference proceedings
  • © 1997

Overview

Editors:
  1. E. Beyne

    1. IMEC, Leuven, Belgium

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  2. C. J. M. Lasance

    1. Philips B.V., Eindhoven, The Netherlands

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  3. J. Berghmans

    1. Catholic University Leuven, Leuven, Belgium

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Table of contents (34 papers)

  1. Front Matter

    Pages i-xi
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  3. Analytical and Computational Thermal Modeling

    1. Front Matter

      Pages 43-43
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    2. Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications, Experimental Validation

      • P. Lybaert, C. Naveau, D. Petitjean, E. Filippi, A. Sturbois
      Pages 45-52

    3. Conjugate Model of a Pin-Fin Heat Sink Using a Hybrid Conductance and CFD Model Within an Integrated Mcae Tool

      • Dereje Agonafer, Arnold Free
      Pages 53-62

    4. Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction Between Three Integrated Circuits

      • B. Fourka, J. B. Saulnier
      Pages 63-72

    5. Heat Transfer in a Vertical Stacking of Plastic Packages

      • Y. Scudeller, C. Val
      Pages 73-82

    6. Electrothermal Simulation of Analogue Integrated Circuits With Ets

      • W. van Petegem, B. Geeraerts, W. Sansen
      Pages 83-92

    7. Calculations of The Temperature Distribution Throughout Electronic Equipments by The Boundary Element Method with the REBECA-3D Software

      • J. P. Fradin, B. Desaunettes
      Pages 93-102

    8. An Interactive Thermal Characterization of Component Placement

      • J. L. Blanchard, S. Louage
      Pages 103-111

  4. Thermal Characterisation

    1. Front Matter

      Pages 113-113
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    2. Thermal Characterization of Electronic Devices by Means of Improved Boundary Condition Independent Compact Models

      • H. Vinke, C. Lasance
      Pages 115-124

    3. Experimental Validation Methods for Thermal Models

      • W. Temmerman, W. Nelemans, T. Goossens, E. Lauwers, C. Lacaze
      Pages 125-136

    4. Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment

      • F. Christiaens, E. Beyne, W. Temmerman, K. Allaert, W. Nelemans
      Pages 137-148

    5. Modelling of IC-Packages Based on Thermal Characteristics

      • I. Ewes
      Pages 149-158

    6. Characterisation of Thermally Enhanced Plastic Packages

      • Are Bjorneklett, Gunnar Gustavsson
      Pages 159-166

    7. Thermal Characterization of Multistripe Heterostructure Lasers

      • V. Lepaludier, Y. Scudeller
      Pages 167-177
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Keywords

About this book

For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Editors and Affiliations

  • IMEC, Leuven, Belgium

    E. Beyne

  • Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

  • Catholic University Leuven, Leuven, Belgium

    J. Berghmans

Bibliographic Information

  • Book Title: Thermal Management of Electronic Systems II

  • Book Subtitle: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

  • Editors: E. Beyne, C. J. M. Lasance, J. Berghmans

  • DOI: https://doi.org/10.1007/978-94-011-5506-9

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media Dordrecht 1997

  • Hardcover ISBN: 978-0-7923-4612-8Published: 31 July 1997

  • Softcover ISBN: 978-94-010-6318-0Published: 05 November 2012

  • eBook ISBN: 978-94-011-5506-9Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: XI, 361

  • Topics: Energy Systems, Classical Mechanics, Electrical Engineering, Automotive Engineering

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