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Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes

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Nanopackaging

Abstract

As integrated circuit (IC) technology continues to advance, there will be increasing demands on I/O counts and power requirements, leading to decreasing solder pitch and increasing current density for solder balls in high-density wafer-level packages [1]. As the electronics industry continues to push for miniaturization, reliability becomes a vital issue. The demand for more and smaller solder bumps, while increasing the current, has also resulted in a significant increase in current density [2], which can cause the failure of solder interconnects due to electromigration [3].

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Authors and Affiliations

  1. Nano/Microsystems Integration Laboratory, Department of Mechanical Engineering, National University of Singapore, Singapore, Singapore

    K. Mohan Kumar & Andrew A. O. Tay

  2. Institute of Microelectronics, 11 Science Park Road, Science Park II, Singapore, Singapore, 117685

    V. Kripesh

Authors
  1. K. Mohan Kumar
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  2. V. Kripesh
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  3. Andrew A. O. Tay
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Editor information

Editors and Affiliations

  1. Dept. Electrical &, Computer Engineering, Portland State University, Portland, Oregon, USA

    James E. Morris

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Kumar, K.M., Kripesh, V., Tay, A.A.O. (2008). Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes. In: Morris, J. (eds) Nanopackaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-47325-3_19

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