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Solder Joint Reliability

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Reliability of Microtechnology

Abstract

Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).

In general, a particular failure mode is the result of certain failure mechanisms in which certain specific combinations of material properties and the surrounding environment act simultaneously. Many different factors have to be considered when assessing the reliability performance of a solder joint structure, such as stress distribution, strain amplitude, strain rate, the cyclic nature of the stress (mechanical, thermal, and thermomechanical), temperature, and many other environmental factors (corrosion, vibration, and so on). Apart from these, the metallurgical and physical behavior of the solder and the solder joint are also very important to take into account, since these also highly affect the reliability behavior of the solder joint.

The aim of this chapter is to increase the knowledge regarding reliability and failure of lead-free solder alloys/joints. This chapter gives an insight into how the microstructure of some lead-free solders is built its stability and some interfacial reactions. An introduction is also given to the failure mechanisms of solder joints, including fatigue failure, which is one of the most significant threats to the integrity of solder joints. Both the effect of second-level solder interconnection and some common standards used when testing solder joint reliability are also mentioned in this chapter.

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Author information

Authors and Affiliations

  1. SMIT Center and Bionano Systems Laboratory Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE-412 96, Göteborg, Sweden

    Johan Liu

  2. Key Laboratory of New Displays and System Integration SMIT Center and School of Mechatronics and Mechanical Engineering, Shanghai University, 282, Room 316, Mechatronics Building, No 149, Yan Chang Road, Shanghai, 200072, China

    Johan Liu

  3. Nokia Siemens Networks, Linnoitustie 6, FI-02600, Espoo, Finland

    Olli Salmela

  4. Nokia Siemens Networks, Kaapelitie 4, FI-90620, Oulu, Finland

    Jussi Särkkä

  5. Department of Electrical & Computer Engineering, Portland State University, 751, Portland, OR, 97207-0751, USA

    James E. Morris

  6. Swerea IVF, 104, SE-431 22, Mölndal, Sweden

    Per-Erik Tegehall

  7. Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE-412 96, Göteborg, Sweden

    Cristina Andersson

Authors
  1. Johan Liu
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  2. Olli Salmela
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  3. Jussi Särkkä
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  4. James E. Morris
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  5. Per-Erik Tegehall
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  6. Cristina Andersson
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Corresponding author

Correspondence to Johan Liu .

Exercises

Exercises

  1. 4.1

    Why is there so much concern about lead?

  2. 4.2

    Why is lead (Pb) being phased out? (Motivation)

  3. 4.3

    Is there legislation that bans Pb use in electronics?

  4. 4.4

    What are the advantages of using Pb-free packages? What effort in eliminating lead-containing solders is coming from Europe?

  5. 4.5

    What is the definition of lead-free?

  6. 4.6

    What problems will meet when converting to lead-free?

  7. 4.7

    Which changes will be necessary in customer processes when using lead-free components?

  8. 4.8

    In the reflow process, is there any necessary to modify printing parameters or stencil design for lead-free?

  9. 4.9

    Do higher soldering temperatures have any negative impact on the moisture sensitivity level (MSL)?

  10. 4.10

    Describe the concept of thermomechanical design of electronic packages as an up-front design activity for screening out and minimizing process and reliability-related failures.

  11. 4.11

    Electronic packaging material properties such as the elastic modulus, E(T), yield stress, σ y (T), and coefficient of thermal expansion, CTE(T) are dependent on temperature. How these properties affect the thermomechanical reliability performance of solder joints in electronic assemblies subjected to thermal cycling loading?

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Liu, J., Salmela, O., Särkkä, J., Morris, J.E., Tegehall, PE., Andersson, C. (2011). Solder Joint Reliability. In: Reliability of Microtechnology. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-5760-3_4

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  • DOI: https://doi.org/10.1007/978-1-4419-5760-3_4

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4419-5759-7

  • Online ISBN: 978-1-4419-5760-3

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