Abstract
Subsystems based upon ICs wire bonded directly to printed wiring boards, have been important constituents of electronic products since the early 1970s. The density of these early systems was quite low and frequently did not connect many unpackaged die. Systems built with this process were said to be based upon chip-on-board (COB) technology. The term multichip module (MCM) has been widely used since the mid-1970s, but was not applied to modules based upon PWBs until the end of the 1980s. In the most common phraseology, the term MCM-L has come to imply an IC assembly comprised of multiple wire bonded die on a PWB. Other types of connection technologies, TAB and flip chip also are practiced in MCM-L systems, but COB assemblies have been the most common. COB involves the use of wire bonding and epoxy glob-top encapsulation, which are usually the lowest cost connection and sealing methods. These systems have typically been tested and burned in at the module level, and defective units are disposable. Higher cost, higher performance die often must be tested and burned-in prior to assembly, and the system cost forces planning for MCM repair. These higher performance die often have higher I/O counts, driving a higher module interconnect density than with the lower cost, disposable modules. Thus, COB modules have developed into a subset of MCM-L, where the modules are disposable and built with untested die. The range of MCM-L technologies has widened considerably in the areas of the materials and methods of substrate fabrication, and in the types of die connection to the board.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
S. Crum, “30 Years of Electronics Technology,” Electr. Packaging & Production,vol. 31, no. 7, pp. 42–46, July 1991.
C. F. Coombs, Handbook of Printed Circuits, 3rd edition, New York: McGraw Hill, 1988.
R. Clark, Handbook of Printed Circuit Manufacturing, New York: Springer Science+Business Media New York, 1985.
L. Smith-Vargo, “Give New Strength to Multilayer Bonding,” Electr. Packaging & Production, vol. 27, no. 2, pp. 52–55, Feb. 1987.
G. Ginsberg, “New Technology for Imaging Circuits on Multilayer Boards,” Electr. Packaging & Production, supplement: Fabricating Advanced Printed Circuit Boards, vol. 30, no. 8, pp. 32–37, May 1990.
C. Guiles, “The Importance of Thermomechanical Properties of High Performance PCB Laminate Materials,” Electronics Manufacturing, vol. 34, no. 10, pp. 41–44, Oct. 1988.
R. Schaefer, R. Ellett, “Higher Productivity from Higher-Stack Drilling,” PC FAB, vol. 14, no. 2, pp. 62–74, Feb. 1991.
J. Murray, “Small-Hole Technology: It Takes More than a Drilling Machine,” PC FAB,vol. 14, no. 2, pp. 52–59, Feb. 1991.
K. Nargi, “Using Subtractive Methods For Multilayer Board Fabrication,” Electronics Manufacturing, vol. 33, no. 11, pp. 9–11, Nov. 1987.
“Wet Processing, Drilling and Inspection For MLBs,” Electr. Packaging & Production, supplement: Fabricating Advanced Printed Circuit Boards, vol. 30, no. 8, pp. 41–45, May 1990.
D. Jacobus, K. Ferris, “Surface Mount Boards With Blind and Buried Vias,” Surface Mount Techn.,vol. 3, no. 2, pp. 44–49, Feb. 1989.
Private communication.
Private communication.
C. Guiles, “High Performance Materials For Printed Wiring Boards,” Proc. NEPCON West, (Anaheim CA), pp. 349–359, 1989.
K. Gilleo, “A New Multilayer Circuit Board Based on Anisotropicity,” Proc. NEPCON West, (Anaheim CA), pp. 8–31, 1990.
C. Martin, “Buried Planar Resistor Technology,” Electr. Packaging & Production, vol. 31, no. 5, p. 81, May 1991.
Private communication
Gore-PlyTM, Gore-CladTM product literature, W. L Gore Associates Incorporated.
J. Olenick, et al., “Fluoropolymer Composite Dielectric Substrates and Invisicon,” Proc. ISHM/IEPS Internat. Conf on Multichip Modules, (Denver CO), pp. 470–481, 1992.
L. Gates, W. Reimmann, “Quartz Fiber in PCBs Improves Temperature Stability,” Electr. Packaging & Production, vol. 23, no. 5, p. 68–73, May 1983.
M. Kato, “Development and Application of MCM-L: Practical Solution for Commercial Type MCM,” Proc. Internat. Conf. on Multichip Modules, (Denver CO), pp. 485–489, 1992.
CERACOMTM product literature, Ibiden Corporation.
Private communication.
W. Pence, D. McQueeney, J. Mosley, “Design of a Silicon-on-Silicon Multi-Chip Module for a High-Performance PS/2 Workstation,” Proc. Multi-Chip Module Conf,IEEE, (Santa Cruz CA), pp. 110–113, 1992.
Private communication.
L. Higgins III, “Perspectives on Multichip Modules: Substrate Alternatives,” Proc. IEEE-MCMC Multi-Chip Module Conf, (Santa Cruz CA), pp. 12–15, 1992.
K. Sakurai, M. Masuda, “Multichip Modules Assembled Using TAB Technology,” Proc. Internat. Tape Automated Bonding Conf., (San Jose CA), pp. 105–115, 1991.
B. Freyman, B. Miles, “A DSP-Based Multichip Modules Employing Multilayer Printed Circuit Board Technology,” Proc. Internat. Conf. on Multichip Modules, (Denver CO), p. 490, 1992.
P. Fischer, “A Parallel Approach to High Density,” PC FAB, vol. 14, no. 11, pp. 3445 Nov. 1991.
G. Geschwind, R. M. Clary, “Multichip Modules: An Overview,” PC FAB, vol. 14, no. 11, pp. 28–38, Nov. 1990.
Editor information
Rights and permissions
Copyright information
© 1993 Springer Science+Business Media New York
About this chapter
Cite this chapter
Higgins, L.M. (1993). Laminate-Based Technologies for Multichip Modules. In: Doane, D.A., Franzon, P.D. (eds) Multichip Module Technologies and Alternatives: The Basics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3100-5_5
Download citation
DOI: https://doi.org/10.1007/978-1-4615-3100-5_5
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-442-01236-6
Online ISBN: 978-1-4615-3100-5
eBook Packages: Springer Book Archive