Abstract
Measurements were made of the deposition of negatively-charged particles (soda-lime glass) and positively-charged particles (aminopropyl glass) from liquid solutions onto silicon wafers with a native oxide. The effects of ionic strength and the pH of the solution on the magnitude and the mechanism of particle deposition were determined by measuring the number of deposited particles in the presence of KC1, KOH and HC1 in a concentration range from 10−5 M to 10−1 M. The results are compared to deposition measurements made in 18 MΩ deionized water. Increasing ionic strength can reduce the particle deposition in systems where a double layer attraction exists, but increase the particle deposition in systems experiencing a double layer repulsion. The influence of pH on deposition was found to depend strongly upon the isoelectric point of both the particle and the wafer. The results of deposition experiments can be readily interpreted in terms of the potential energy of interaction which exists between the particles and the wafer surfaces.
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References
K.L. Mittal, editor, “Particles on Surfaces 1: Detection, Adhesion, and Removal,” Plenum Press, New York, 1987.
K.L. Mittal, editor, “Particles on Surfaces 2: Detection, Adhesion, and Removal,” Plenum Press, New York, 1989.
K.L. Mittal, editor, “Particles on Surfaces 3: Detection, Adhesion, and Removal,” Plenum Press, New York, 1991.
J.K. Marshall and J.A. Kitchener, J. Colloid Interface Sci., 22, 342–351(1966).
M. Hull and J.A. Kitchener, Trans. Faraday Soc, 65, 3093–3104(1969).
B.D. Bowen and N. Epstein, J. Colloid Interface Sci., 22, 81–97(1979).
A.M.J. Davis, J. Colloid Interface Sci., 94, 140–144(1983).
T. Dabros and T.G.M. van de Ven, Colloid Polym. Sci., 261, 694–707(1983).
K. Adamcyk, M. Zembala, B. Siwek, and J. Czarnecki, J. Colloid Interface Sci., 110, 188–200(1986).
D.J. Riley and R.G. Carbonell, J. IES, 34, 28–34(1991).
D.J. Riley and R.G. Carbonell, Microcontamination, 8 (12), 19–25 (1990).
D.J. Riley and R.G. Carbonell, Proc. 36th Annual Technical Meeting of the Institute of Environmental Sciences, 224-228(1990).
R.J. Hunter, “Foundations of Colloid Science,” Vol. 1, Chapter 7, Clarendon Press, Oxford, 1987.
E.J.W. Verwey and J. Th. G. Overbeek, “Theory of the Stability of Lyophobic Colloids,” Elsevier Publishing Company, Amsterdam, 1948.
J. Gregory, J. Colloid Interface Sci., 83, 138–145(1981).
J. Visser, Adv. Colloid Interface Sci., 3, 331–363(1972).
R. Hogg, T.W. Healy, D.W. Fuerstenau, Trans. Faraday Soc., 62., 1638–1651(1966).
P.C. Hiemenz, “Principles of Colloid and Surface Chemistry,” 2nd ed., Chapters 12 and 13, Marcel Dekker, New York, 1986.
G. DuVal, H.E. Swaisgood, and J.R. Horton, J. Appl. Biochem., 6, 240–250(1984).
I. Ali., Doctoral Dissertation, University of Arizona, 110(1991).
L.D. Michaels, V.B. Menon, R.P. Donovan, and D.S. Ensor, Proc. 34th Annual Meeting of the Institute of Environmental Sciences, 438-442 (1988).
M. Itano, I. Kawanabe, F.W. Kern Jr., M. Miyashita, R.W. Rosenberg, T. Ohmi, R. Fukushima, and S. Akiyama, in “Particles on Surfaces 3: Detection, Adhesion and Removal,” K.L. Mittal, editor, pp. 35–49, Plenum Press, New York, 1991.
M. Elimelech, J. Colloid Interface Sci., 146, 337–352(1991).
F.W. Kern Jr., M. Itano, I. Kawanabe, M. Miyashita, R.W. Rosenberg, and T. Ohmi, paper presented at the Institute of Environmental Sciences 37th Annual Technical Meeting, San Diego, CA, May 1991.
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Riley, D.J., Carbonell, R.G. (1993). The Influence of Solution Properties on the Deposition of Particles from Liquid Media onto Silicon Wafer Surfaces. In: Mittal, K.L. (eds) Particles in Gases and Liquids 3. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-1187-2_4
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DOI: https://doi.org/10.1007/978-1-4899-1187-2_4
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