Abstract
The packaging design of a launch-vehicle guidance computer is described. The computer uses microminiature technology, of which the basic module is a ceramic substrate with deposited resistors and uncased semiconductor devices. The memory section contains up to eight modules of 4096 words; the modules are self-contained by incorporating toroidal core arrays, memory, drivers, and sense amplifiers as a unit. To minimize structure weight, a magnesium—lithium material is used. This material has the inherent properties of high damping capacity with a high strength-to-weight ratio. Also described is the development program that led to these packaging concepts, along with the in-process testing used to ensure design adequacy prior to final assembly.
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© 1965 Springer Science+Business Media New York
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Bonis, S., Jackson, R., Pagnani, B. (1965). Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_21
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DOI: https://doi.org/10.1007/978-1-4899-7307-8_21
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7295-8
Online ISBN: 978-1-4899-7307-8
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