Abstract
Phass-shifted shadow Moire has gained more applications in electronic industry. However, printed circuit boards (PCB) may contain many cavities or specular materials on the surface that make the phase-unwrapping of Moire fringe patterns more difficult or fail. In this paper, a method is proposed to overcome this difficulty to process the phase-shifted fringe patterns effectively and automatically for surface profile measurement. Firstly the intensity values of the original four phase-shifted fringe patterns are averaged and differentiated to enhance the erroneous spots. Then the median grey-level value of the enhanced image is used as the threshold to binarize the enhanced image to find the erroneous bright and black spots. According to the largest size of erroneous spot, the size of a structuring element is determined for morphology filtering. Thereafter the phase can be calculated and unwrapped correctly. Test of the method on a PCB is demonstrated and discussed.
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References
Malacara D (1992) Twyman-green interferometer. In: Malacara D (ed) Optical shop testing. Wiley, New York, ch. 2
Moore AJ, Tyrer JR (1990) An electronic speckle pattern interferometry for complete in-plane displacement measurement. Meas Sci Technol 1:1024–1030
Butters JN, Leendertz JA (1971) Holographic and video techniques applied to engineering measurement. J Meas Control 4:349–354
Zheng T, Danyluk S (2000) Nondestructive measurement of in-plane residual stress in silicon strips. Proc Mater Res Soc Symp 591:283–287
Vrinceanu ID, Danyluk S (2002) Measurement of residual stress in single crystal silicon wafers. In: Proceeding 8th international symposium advanced package materials, Stone Mountain, GA, USA, pp 297–301
Wang Y, Hassell P (1998) On-line measurement of thermally induced warpage of BGA’s with high sensitivity shadow Moiré. Proc Int J Microcircuit Electron Packag 23:191–196
Chen T Y, Chen JS (2011) Warpage measurement of printed circuit board by using phase-shifted shadow moiré 2011 International conference on Advanced Technology. In: Experimental mechanics, Kobe, Japan
Post D, Han B, Ifju P (1994) High sensitivity Moiré. Springer, New York, pp 85–133
Macy WW (1983) Two-dimensional fringe-pattern analysis. Appl Opt 22(23):3898–3901
Kinger T (2003) Image processing with LabVIEW and IMAQ Vision. Prentice Hall, Upper Saddle River
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This work is supported by National Science Council, Republic of China under the contract no. NSC-101-2221-E-006-101.
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© 2014 The Society for Experimental Mechanics, Inc.
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Chen, T.Y., Lin, J. (2014). Automated Surface Profile Measurement of Printed Circuit Boards by Phase-Shifted Shadow Moiré. In: Jin, H., Sciammarella, C., Yoshida, S., Lamberti, L. (eds) Advancement of Optical Methods in Experimental Mechanics, Volume 3. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-00768-7_30
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DOI: https://doi.org/10.1007/978-3-319-00768-7_30
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