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DEIS: Dependability Engineering Innovation for Industrial CPS

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Advanced Microsystems for Automotive Applications 2017

Abstract

The open and cooperative nature of Cyber-Physical Systems (CPS) poses new challenges in assuring dependability. The DEIS project (Dependability Engineering Innovation for automotive CPS. This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 732242, see http://www.deis-project.eu) addresses these challenges by developing technologies that form a science of dependable system integration. In the core of these technologies lies the concept of a Digital Dependability Identity (DDI) of a component or system. DDIs are modular, composable, and executable in the field facilitating (a) efficient synthesis of component and system dependability information over the supply chain and (b) effective evaluation of this information in-the-field for safe and secure composition of highly distributed and autonomous CPS. The paper outlines the DDI concept and opportunities for application in four industrial use cases.

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Notes

  1. 1.

    https://www.avl.com/-/avl-vsm-vehicle-simulation.

  2. 2.

    http://www.healthcareitnews.com/news/precision-medicine-growth-hinges-electronic-health-records.

  3. 3.

    http://oncoassist.com/.

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Correspondence to Eric Armengaud .

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© 2018 Springer International Publishing AG

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Armengaud, E. et al. (2018). DEIS: Dependability Engineering Innovation for Industrial CPS. In: Zachäus, C., Müller, B., Meyer, G. (eds) Advanced Microsystems for Automotive Applications 2017. Lecture Notes in Mobility. Springer, Cham. https://doi.org/10.1007/978-3-319-66972-4_13

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  • DOI: https://doi.org/10.1007/978-3-319-66972-4_13

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-66971-7

  • Online ISBN: 978-3-319-66972-4

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