Abstract
In this work, we report the effect of stress generated in a photo-resist film during micro lithography sequence and its impact on selective electro plating process. Series of experiments were carried out to find an optimum pre-bake temperature which resulted in more control over stress generated in the photo-resist film and hence seepage free smooth plating process.
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Kumar, N. et al. (2019). Thermal Control of Stress in Photoresist Film for Improving Selectivity in Electro-Plating Process. In: Sharma, R., Rawal, D. (eds) The Physics of Semiconductor Devices. IWPSD 2017. Springer Proceedings in Physics, vol 215. Springer, Cham. https://doi.org/10.1007/978-3-319-97604-4_41
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DOI: https://doi.org/10.1007/978-3-319-97604-4_41
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