Skip to main content

2020 World with Chips

  • Chapter
  • First Online:
Chips 2020

Part of the book series: The Frontiers Collection ((FRONTCOLL))

  • 4057 Accesses

Abstract

Although we are well advised to look at the future 1 day at a time, we have seen in the chapters of this book, and they necessarily could cover only a selection on the features and applications of those tiny chips, that their potential continues to grow at the exceptional rates of the past. However, the new commitment has to be towards Sustainable Nanoelectronics, guided by creating sensing, computing, memory, and communication functions, which move just a few electrons per operation, each operation consuming energy less than one or a few femtojoule, less than any of the 1014 synapses in our brains. At these energy levels, chips can serve everywhere, making them ubiquitous, pervasive, certainly wireless, and often energy-autonomous. The expected six Billion users of these chips in 2020, through their mobile, intelligent companions, will benefit from global and largely equal access to information, education, knowledge, skills, and care.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 54.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Cohn, J.: Kids today! Engineers tomorrow? IEEE ISSCC (International Solid-State Circuits Conference) Digest Technical Papers, pp. 29–35 (2009)

    Google Scholar 

  2. Boyle, W.S., Smith, G.E.: Charge Coupled Semiconductor Devices, Bell Sys. Tech. J. Vol. 49, pp. 587–593, Apr. 1970.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Bernd Hoefflinger .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2011 Springer-Verlag Berlin Heidelberg

About this chapter

Cite this chapter

Hoefflinger, B. (2011). 2020 World with Chips. In: Hoefflinger, B. (eds) Chips 2020. The Frontiers Collection. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23096-7_23

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-23096-7_23

  • Published:

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-22399-0

  • Online ISBN: 978-3-642-23096-7

  • eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)

Publish with us

Policies and ethics