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Film Alignment before Solder Mask Exposure

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Image Processing and Communications Challenges 3

Part of the book series: Advances in Intelligent and Soft Computing ((AINSC,volume 102))

Summary

In this paper method, based on the Radon transformation, used to align film and panel for a solder mask targets during registration before exposure, is presented. One of the challenges for the registration system is the images quality. System stability can depend on the type of liquid (LPI) or dry film (DFSM) used as a mask, resulting in changes of the panel reflection. Proposed method will be used to supply requested parameters for the alignment process used in the dedicated exposure machine based on LED technology.

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References

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Author information

Authors and Affiliations

  1. Institute of Telecommunication, University of Technology and Life Sciences, Kaliskiego 7, 85-791, Bydgoszcz, Poland

    Adam Marchewka & Jarosław Zdrojewski

Authors
  1. Adam Marchewka
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  2. Jarosław Zdrojewski
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Editor information

Editors and Affiliations

  1. Institute of Telecommunications, University of Technology & Life Sciences, ul.S.Kaliskiego 7, 85-791, Bydgoszcz, Poland

    Ryszard S. Choraś

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© 2011 Springer-Verlag Berlin Heidelberg

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Marchewka, A., Zdrojewski, J. (2011). Film Alignment before Solder Mask Exposure. In: Choraś, R.S. (eds) Image Processing and Communications Challenges 3. Advances in Intelligent and Soft Computing, vol 102. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23154-4_43

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  • DOI: https://doi.org/10.1007/978-3-642-23154-4_43

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-23153-7

  • Online ISBN: 978-3-642-23154-4

  • eBook Packages: EngineeringEngineering (R0)

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