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A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites

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Bio and Nano Packaging Techniques for Electron Devices

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Abstract

Thermal problems are one of the most crucial problems that must be addressed when designing electronic systems with high-density nano-scale structures. A promising approach is the enhancement of the thermal conductivity by using thermal vias with thermally high-conductive composites, such as polymers filled with carbon nanotubes (CNTs). The chapter presents a modeling approach that considers the complex behavior of CNTs in composites in order to predict the thermal system behavior. The approach is based on a hierarchical finite element analysis model of thermal via arrays. It comprises the levels CNT, composite base cube, thermal via and via array. By using the effective medium approach of a composite base cube, CNTs can be integrated into a macroscopic model despite their nanometer scale. Such an optimized model of thermal via arrays using CNT-based composites significantly simplifies thermal simulations of these nanoscale structures. Results achieved using the presented modeling approach allow an efficient comparision of various technological solutions prior to practical experiments.

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Authors and Affiliations

  1. Institute of Electromechanical and Electronic Design, Technische Universität Dresden, 01062, Dresden, Germany

    Jörg Hertwig, Holger Neubert & Jens Lienig

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  1. Jörg Hertwig
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  2. Holger Neubert
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Correspondence to Holger Neubert .

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  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Hertwig, J., Neubert, H., Lienig, J. (2012). A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_30

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