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Highly Flexible and Transparent Skin-like Tactile Sensor

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Haptic Interaction

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 277))

Abstract

This demonstration shows a highly flexible, transparent, and thin tactile sensor. The sensor detects touch forces at single or multiple points with fast response and high bendability in response to dynamic input force (0–3 N) without any electronic components on sensing areas. The sensor is also capable of sensing pressure on curvilinear soft surface such as human skin without significant performance degradation. The force sensor has potentials to be used in a number of applications for measuring dynamic contact forces on various surfaces.

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References

  1. Yun, S., Park, S., Park, B., Kim, Y., Park, S.K., Nam, S., Kyung, K.U.: Polymer-waveguide-based flexible tactile sensor array for dynamic response. Adv. Mater. 26, 4474–4480 (2014)

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Acknowledgements

This work was supported by the ETRI and MKE/KEIT, [Development of Transparent Actuator and UX, TAXEL: Visio-haptic Display and Rendering Engine (10035360)].

Author information

Authors and Affiliations

  1. Transparent Transducer and UX Creative Research Center, ETRI, Daejeon, South Korea

    Saekwang Nam, Suntak Park, Sungryul Yun, Bong Je Park, Seung Koo Park, Mijeong Choi & Ki-Uk Kyung

Authors
  1. Saekwang Nam
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  2. Suntak Park
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  3. Sungryul Yun
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  4. Bong Je Park
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  5. Seung Koo Park
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  6. Mijeong Choi
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  7. Ki-Uk Kyung
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Corresponding author

Correspondence to Ki-Uk Kyung .

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Editors and Affiliations

  1. The University of Electro-Communications, Tokyo, Japan

    Hiroyuki Kajimoto

  2. Osaka University, Osaka, Japan

    Hideyuki Ando

  3. Electronics and Telecommunications Research Institute, Seoul, Korea, Republic of (South Korea)

    Ki-Uk Kyung

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© 2015 Springer Japan

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Nam, S. et al. (2015). Highly Flexible and Transparent Skin-like Tactile Sensor. In: Kajimoto, H., Ando, H., Kyung, KU. (eds) Haptic Interaction. Lecture Notes in Electrical Engineering, vol 277. Springer, Tokyo. https://doi.org/10.1007/978-4-431-55690-9_36

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  • DOI: https://doi.org/10.1007/978-4-431-55690-9_36

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  • Publisher Name: Springer, Tokyo

  • Print ISBN: 978-4-431-55689-3

  • Online ISBN: 978-4-431-55690-9

  • eBook Packages: EngineeringEngineering (R0)

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