Abstract
Different laser technologies can be used in the processing sequence of ceramic substrates and packages applied for multi-chip modules. An interesting new possibility is the application of aluminium nitride which exhibit specific properties (e.g. good thermal conductivity and chemical resistivity) that are important for substrate and packaging materials. Compatible technologies developed for aluminium nitride ceramics improve the applicability of this material. The possibilities and limitations of laser processing technologies for A1N ceramics and some experimental results are discussed.
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© 1995 Springer Science+Business Media Dordrecht
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Illyefalvi-Vitéz, Z. (1995). Laser Processing in MCM-C Technologies. In: Jones, W.K., Kurzweil, K., Harsányi, G., Mergui, S. (eds) MCM C/Mixed Technologies and Thick Film Sensors. NATO ASI Series, vol 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0079-3_9
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DOI: https://doi.org/10.1007/978-94-011-0079-3_9
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